By Dr. Jian Li Senior Process Engineer, Semiconductor Equipment Division Jiangsu Himalaya Semicondcutor Co., Ltd. 15+ years of experience in IC packaging, die bonding, micro-assembly, and plasma surface treatment
Quick Answer
The PLASMA VP-60L is a professional 60-liter RF vacuum plasma cleaner designed for semiconductor packaging, PCB manufacturing, lithium battery processing, and precision electronics surface activation. Featuring fully automatic RF matching, adjustable 0–500W plasma power, and multi-gas capability (Ar, N₂, O₂, H₂, CH₄), the system delivers highly repeatable low-pressure plasma treatment for industrial cleaning, oxide removal, and adhesion enhancement.
In advanced electronics manufacturing, achieving ultra-clean and highly activated surfaces is critical for reliable bonding, coating, printing, encapsulation, and assembly. Even microscopic organic residues or oxide contamination can significantly reduce bonding strength, electrical reliability, and long-term product stability.
The PLASMA VP-60L RF Vacuum Plasma Cleaner is a high-performance low-pressure plasma treatment system engineered for precision surface cleaning and activation across semiconductor, PCB, display, medical, automotive, and new energy industries.
As a Senior Process Engineer at Jiangsu Himalaya Semiconductor Co., Ltd., I have worked extensively with plasma surface treatment systems in backend semiconductor packaging and microelectronics assembly. The PLASMA VP-60L provides an excellent balance of process stability, automation, repeatability, and cost-efficiency for both R&D laboratories and medium-to-high volume manufacturing environments.
Why Plasma Surface Treatment Matters
RF plasma cleaning removes microscopic organic contamination, oxide layers, and molecular residues that conventional wet cleaning processes often cannot eliminate effectively.
In semiconductor packaging and precision electronics assembly, plasma activation improves surface energy, enabling:
Stronger die bonding adhesion
Improved wire bonding reliability
Better underfill wetting
Enhanced coating uniformity
Reduced delamination risk
Higher long-term package reliability
Compared with traditional solvent cleaning, vacuum plasma treatment offers:
Dry and environmentally friendly processing
No chemical waste disposal
Lower contamination risk
Superior treatment uniformity
Excellent process repeatability
Better compatibility with sensitive electronic components
Key Technical Specifications
Item
Specification
Equipment Model
PLASMA VP-60L
External Dimensions
1100(D) × 810(W) × 1550(H) mm
Vacuum Chamber Size
492(D) × 390(W) × 350(H) mm
Electrode System
4-layer horizontal plates
Electrode Layer Height
46 mm
Rated Power
3.5 kW
Power Supply
AC380V ±10% @ 50Hz
Working Vacuum Level
10–60 Pa
Vacuum Evacuation Time
<180 seconds to 30 Pa
Vacuum Break Time
<30 seconds
RF Power
0–500W continuously adjustable
RF Power Accuracy
±3%
RF Matching
Fully automatic, <10s stabilization
Process Gases
Ar, N₂, O₂, H₂, CH₄
Gas Channels
2 channels
MFC Flow Range
0–200 sccm
Machine Weight
Approx. 500 kg
Customization
Chamber size & electrode layout customizable
Core Advantages of the PLASMA VP-60L
Superior Surface Cleaning
The system effectively removes:
Organic contamination
Oxide films
Flux residue
Fingerprints
Molecular-level surface impurities
This significantly improves downstream bonding and coating performance.
Excellent Adhesion Enhancement
The RF plasma process increases surface energy for improved:
Die attach adhesion
Wire bonding preparation
Conformal coating
Ink printing
Epoxy bonding
SMT pre-treatment
Fast Industrial Processing
Typical plasma process cycles range from:
2–10 minutes depending on material and treatment requirements
The rapid evacuation system and automatic RF matching improve throughput efficiency.
High Process Repeatability
The PLASMA VP-60L uses:
Precision RF power control
Dedicated mass flow controllers (MFC)
Stable vacuum regulation
Automatic process sequencing
This ensures highly consistent plasma treatment results batch after batch.
User-Friendly Fully Automated Operation
The system supports:
PLC control architecture
High-resolution touchscreen interface
Recipe storage
One-key automatic operation
Manual and automatic modes
Operators with minimal training can quickly perform stable production processes.
Typical Process Parameters
Material
Process Gas
RF Power
Treatment Time
Lead Frames
Ar/O₂
200W
120s
PCB Panels
O₂
300W
180s
PTFE/Teflon
Ar
400W
300s
Silicon Wafers
Ar/N₂
250W
150s
Lithium Battery Foil
O₂
350W
240s
Polymer Films
Ar/O₂
200W
90s
Actual parameters may vary depending on contamination level, material composition, and production requirements.
Wide Industrial Applications
The PLASMA VP-60L is widely used across advanced electronics manufacturing industries.
Semiconductor & IC Packaging
Ideal for:
Wire bonding preparation
Lead frame plasma cleaning
Die attach surface activation
Underfill adhesion improvement
IC package contamination removal
PCB Manufacturing
Suitable for:
Blind hole desmearing
SMT pre-treatment
Surface activation before coating
Residue removal
Adhesion enhancement
Consumer Electronics
Common applications include:
Mobile phone middle frames
Camera modules
Fingerprint sensors
Earphone diaphragms
Flexible electronic assemblies
Display Industry
Used for:
LCD ARRAY cleaning
CF glass treatment
ITO glass activation
Polarizer surface treatment
New Energy & Battery Industry
The system supports plasma treatment for:
Lithium battery separators
Aluminum foil activation
Energy storage materials
Battery component cleaning
Automotive Electronics
Widely applied in:
Sensors
Connectors
Ignition coils
Automotive PCB assemblies
Medical & Precision Plastics
Suitable materials include:
PTFE/Teflon
Engineering plastics
Polymer films
Precision molded components
Equipment Processing Workflow
The PLASMA VP-60L features a streamlined and highly automated operating process:
Load materials onto 4-layer electrode trays
Close chamber door and select process recipe
Automatic vacuum evacuation
Process gas inlet and stabilization
RF plasma ignition and treatment
Automatic venting and unloading
The system supports both fully automatic and manual operation modes for maximum production flexibility.
Maintenance & Service Support
Routine maintenance requirements are minimal.
Easy Maintenance
Weekly chamber cleaning using isopropyl alcohol
Oil-free scroll vacuum pump reduces maintenance frequency
Stable RF system minimizes calibration requirements
Q1: What is the typical cycle time of the PLASMA VP-60L?
Most plasma cleaning and activation processes require approximately 2–10 minutes depending on material type and treatment objectives.
Q2: Which gases are supported?
The system supports:
Argon (Ar)
Nitrogen (N₂)
Oxygen (O₂)
Hydrogen (H₂)
Methane (CH₄)
Two gas channels with precision MFC control are included.
Q3: Is the system suitable for volume production?
Yes. The combination of:
Fast pump-down time
Automatic operation
4-layer electrode configuration
Stable RF control
makes the system suitable for medium-to-high volume manufacturing.
Q4: Can the chamber size be customized?
Yes. Chamber dimensions, electrode configurations, and fixture layouts can be customized according to customer process requirements.
Q5: What materials can be treated?
The system can process:
Silicon wafers
Glass
Metals
Ceramics
Plastics
PTFE
Polymer films
Composite materials
Q6: Is daily operation difficult?
No. The touchscreen interface and one-key automatic operation make the equipment highly user-friendly after basic training.
Q7: Do you provide installation and process training?
Yes. Full installation, commissioning, operator training, maintenance guidance, and process optimization support are provided.
About the Author
Dr. Jian Li is a Senior Process Engineer in the Semiconductor Equipment Division at Jiangsu Himalaya Semiconductor Co., Ltd.. With over 15 years of experience in die bonding, wire bonding, micro-machining, and plasma surface treatment, Dr. Li has contributed to multiple equipment innovation and process optimization projects for high-reliability semiconductor packaging applications.
With R&D operations in Suzhou and sales support in Xi’an, Himalaya Semiconductor serves global electronics manufacturers with reliable, high-performance semiconductor assembly equipment.
Ready to Improve Your Surface Treatment Process?
The PLASMA VP-60L delivers reliable, repeatable, and cost-effective RF plasma surface treatment for semiconductor packaging, PCB manufacturing, precision electronics, and advanced material processing.
For quotations, customization options, or sample evaluation support, contact:
