IC High-Speed Fully Automatic Wafer Die Bonder Machine with Highly Accurate Die Rotation System
At-a-Glance (What DA801 Delivers)
- Machine type: Fully automatic IC die bonder / die attach
- Wafer size: 6"–8"
- Speed (DA801): 220 ms cycle time
- Die size range: 0.17 × 0.17 mm to 6.25 × 6.25 mm
- Substrate size: up to 300 × 320 mm (model-dependent)
- Bond force: 30–500 g programmable (voice-coil force control)
- Vision: Multi-color PR (R/G/B) + Auto-Focus; 640 × 480 (customizable)
- Connectivity: Ethernet/IP, automation protocol support (SECS/GEM / SEMI online)
- Customization: Available for special designs and line requirements
Typical Applications
DA801 is suitable for packaging processes where speed, placement stability, and flexible substrate handling are required, including:
- IC packaging / general die attach
- LED packaging (including Mini/Micro LED)
- Power devices (packages using ceramic, thick copper, heat sinks, etc.)
- Multi-substrate production (glass, ceramic, PCB, lead frames)
Key Production Features
High-speed linear-driven bond head
A linear-driven bond head is designed for fast placement with controlled motion, supporting stable cycle times and repeatability in continuous production.
Highly accurate die rotation system + motorized wafer expansion
- High-precision wafer table with a die rotation system for angle correction during placement
- Motorized wafer expansion for stable die pickup and consistent indexing
Dual dispensing system + intelligent glue volume control
- Dual dispensing supports flexible process routing
- Intelligent dispensing control helps achieve precision glue volume control, improving consistency across lots
DAF (Die Attach Film) capability
Supports DAF processes for applications requiring film-based attach workflows and cleaner dispense variation control.
Missing die detection & re-picking
Integrated functions to reduce placement defects and improve yield:
- missing die detection
- re-pick/re-try handling logic (process dependent)
Multifunction work table
A multifunction work table supports different lead frames and substrates for mixed production needs.
Models & Selection Guide
- DA801 (Basic model): Speed-focused configuration for mid-volume production and multi-scenario packaging.
- DA801S / DA801M (High-precision models): Higher placement precision configuration for tighter tolerance applications (e.g., higher-accuracy LED/optical/automotive-type processes).
Technical Specifications
1) Equipment Model & Basic Parameters
| Parameter | DA801 | DA801S / DA801M |
|---|---|---|
| Cycle Time | 220 ms | (Consult for configuration) |
| Wafer Size | 6"–8" | 6"–8" |
| Die Size | 0.17×0.17 mm – 6.25×6.25 mm | 0.17×0.17 mm – 6.25×6.25 mm |
| Substrate Size | 110×320 mm – 300×320 mm | 110×300 mm – 300×300 mm |
2) Core Performance Metrics
| Parameter | DA801 | DA801S / DA801M |
|---|---|---|
| XY Placement Precision | ±25 μm @ 3σ | ±10–20 μm @ 3σ |
| θ (Placement Rotation) Precision | ±1° | (Consult for configuration) |
| Bond/Placement Force | 30–500 g programmable | 30–500 g programmable |
| Vision Resolution | 640×480 (customizable) | 640×480 (customizable) |
Note on angle specs (kept consistent): θ-axis precision (±1°) refers to placement rotation performance. The vision system may have finer angular recognition capability (see PR system below), which supports alignment/inspection.
3) Key Components
| Component | Specification | Notes |
|---|---|---|
| Pattern Recognition (PR) | Multi-color (R/G/B) + Auto-Focus | Supports mixed-color chips and stable recognition |
| PR Angular Accuracy | ±0.1° | Vision recognition/measurement capability |
| Motion Control | Servo motors, linear guides | Designed for high repeatability |
| Worktable Load | ≤15 kg | Supports heavier substrates/heat sinks |
| Vacuum System | 0.1–100 kPa, flow rate ≥50 L/min | Fast suction/release for thin dies |
4) Automation, Controls & Interfaces
- Automation / communication: Supports SEMI online communication and SECS/GEM protocol (as configured)
- Interface: Ethernet/IP for line integration and MES connectivity
- Force control: High-precision force control system uses voice coil to control bonding pressure
- IQC displays: User interface supports EPOXY IQC and POST IQC graphic display
- Intelligent compensation: Automatic glue volume and bond placement compensation based on inspection system (process dependent)
5) Dimensions & Installation
| Parameter | Value |
|---|---|
| Equipment Size (W×D×H) | 2100×1260×1500 mm |
| Weight | 1100 kg |
| Recommended Cleanroom | Class 10000 |
| Integration | Standalone tool; line/robot integration ready (configuration dependent) |
Why DA801 for Production Lines?
- Speed + accuracy balance: High-speed cycle time with precision placement capability (model dependent)
- Wide compatibility: Supports 6–8" wafers and large substrate formats; compatible with multiple substrate materials
- Automation-ready: Communication protocols and Ethernet/IP support for production integration
- Process control: Intelligent dispensing + inspection-linked compensation options
- Customization available: Special design requests supported (substrate handling, optics, motion, vacuum, etc.)
FAQ
1) What's the difference between DA801 and DA801S/DA801M?
DA801 is the base high-speed model. DA801S/DA801M are high-precision variants offering tighter XY placement precision for more demanding applications.
2) Does DA801 support DAF?
Yes, DA801 supports DAF (Die Attach Film) function.
3) What wafer sizes are supported?
6-inch to 8-inch wafers (150–200 mm).
4) What substrates can it run?
The multifunction work table supports different lead frames and substrates; substrate size range depends on model.
Contact / RFQ
Share your die size, wafer size, substrate type & size, target UPH/cycle time, and required placement tolerance. We'll recommend a configuration (DA801 vs DA801S/DA801M) and provide a process-aligned quotation and layout.