High-Speed Fully Automatic Wire Bonder for Semiconductor Packaging
Key Features & Industry-Leading Advantages
Ultra-High Precision & Speed
1.45ms/line bonding cycle with ±3μm repeatability (3σ) for ICs like BGA, QFP, COB, and optocouplers.
2.Linear motor-driven XY table (56mm × 80mm area) ensures rapid, accurate positioning.
Advanced Vision & Control
1.New zoom lens with wider FOV and clearer imaging for complex wire patterns.
2.Servo system enhances UPH (Units Per Hour) with real-time force calibration and intelligent bonding force alerts.
Multi-Material Compatibility
1.Handles Φ15–50μm gold/copper wires and supports TO, SOP, TSSOP, DIP, and more.
2.Patented arc algorithm adapts to diverse materials and complex geometries.
Reliability & Smart Maintenance
1.>1M mold life with pneumatic drives and monthly remote technical support.
2.Post-bond inspection (PBI) and defense-line modules ensure consistent quality.
Automated Material Handling
Vertical stacked magazines (2–3 buffers) for 100–275mm × 30–90mm trays (pitch: 1.5–10mm).
Technical Specifications
Dimensions: 985mm × 960mm × 1770mm | Weight: 660kg
Driven Type: Linear motor | Warranty: 12 months
HS Code: 8486402200 | Origin: China
✔ Why Choose Us?
● Annual tech updates and on-site customer training (2–4 visits/year)
| Feature/Specification | Detail |
| Model Number | H580PLUS |
| Condition | New |
| Certifications | CCC, PSE, FDA, RoHS, ISO, CE |
| Warranty | 12 Months |
| Automatic Grade | Automatic |
| Installation | Vertical |
| Driven Type | Pneumatic |
| Mould Life | >1,000,000 Shots |
| Online Technical Guidance | Once Every Month |
| Customer Production/Use Visits | 2-4 Times/Year |
| Customer Technical Personnel Invitations | 2 Per Year (S2 Opportunities) |
| Introduction of Domestic Advanced Technology/Updates | Every Year |
| Transport Package | International Trade Standard |
| Specification (Dimensions) | 985mm * 960mm * 1770mm |
| Trademark | Himalaya |
| Origin | China |
| HS Code | 8486402200 |