High-Performance 12-Inch CMP Systems: Precision Polishing for TSV Interconnects
Optimized for TSV Interposer Fabrication
Our 12-inch CMP system is specifically engineered to handle the complexities of multi-layer polishing. By integrating a high-throughput EFEM, a powerful 3-platen/4-head polisher, and a sophisticated in-line cleaning system, we provide a seamless "dry-in, dry-out" workflow.
Key Equipment Specifications:
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Wafer Size: 12-Inch (300mm)
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Wafer Thickness: 500~800μm
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Polishing Configuration: 3 Platens + 4 Independent Heads
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Integrated Cleaner: 1 MEG tank, 2 Brush tanks, and 1 SRD (Spin Rinse Dryer)
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Control System: Windows 10 based with precision CLC (Closed Loop Control) for Slurry and Chemical flow.
Industry-Leading Process Performance
At Himalaya Semiconductor, we understand that Removal Rate (RR) and Within-Wafer Non-Uniformity (WIW NU) are the metrics that define your ROI. Our system is benchmarked to deliver high-speed material removal while maintaining a 5mm edge exclusion:
| Process Layer | Removal Rate (Target) | WIW Non-Uniformity (1σ) |
| Copper (Cu) | 5000 ~ 10000 Å/min | ≤ 5% |
| Barrier | 800 Å/min | ≤ 5% |
| Oxide (TEOS) | 3500 Å/min | ≤ 5% |
Beyond individual wafer performance, our hardware ensures Head-to-Head Non-Uniformity of ≤ 4%, guaranteeing consistent results across all four polishing heads for high-volume manufacturing (HVM).
Reliability You Can Bank On
In a 24/7 fabrication environment, uptime is everything. Our CMP tool is built for the long haul, backed by rigorous reliability standards:
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Uptime: ≥ 85%
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MTBF (Mean Time Between Failures): ≥ 200 hours
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MTTR (Mean Time To Repair): ≤ 3.5 hours
Furthermore, our integrated cleaner ensures superior particle control, with a post-CMP clean adder of ≤ 50ea (at ≥ 0.2μm), protecting your wafers from defects and cross-contamination.
Comprehensive Support & Warranty
When you partner with Jiangsu Himalaya Semiconductor, you aren't just buying a machine; you are gaining a dedicated support team.
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Full-Cycle Testing: We conduct rigorous pre-shipment, functional, and final acceptance testing at your facility to ensure the tool meets every SPEC.
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Expert Training: We provide a 5-day intensive training program covering everything from recipe optimization and software interface to preventative maintenance (PM) and alarm handling.
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Local Rapid Response: For our clients in China, we offer 24-hour on-call service and guarantee personnel arrival at your factory within 48 hours.
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12-Month Warranty: Enjoy peace of mind with a comprehensive warranty covering spare parts and technical support post-acceptance.
Contact Us for an RFQ
Ready to upgrade your 300mm polishing capabilities? Visit us or contact our technical sales team for a detailed quote tailored to your specific TSV or interposer process.
Company: Jiangsu Himalaya Semiconductor Co., Ltd.
Address: Room 4234, Building 11, No. 1258 Jinfeng South Road, Mudu Town, Wuzhong District, Suzhou City
Specialization: Advanced Semiconductor CMP & Vacuum Technology Solutions