High-Speed Die Bonder | XK-Marlin Precision Die Bonding Equipment
Die Bonding Machine & Equipment Solutions for Semiconductor Manufacturing
What is Die Bonding and Why It Matters
Product Advantages: Precision and Performance
Our precision die bonding machine systems are designed to excel in critical die bonding applications. The bonding equipment for die attachment offers significant advantages:
Enhanced Accuracy & Throughput: Optimized image recognition, a high-resolution digital camera, and an advanced optical system ensure superior performance for demanding electronic packaging and IC packaging tasks.
Superior Process Control: With welding process monitoring (BPM) and pick tool wear monitoring, this semiconductor die bonding machine provides unparalleled control over the die attachment process, ensuring consistent quality.
Unmatched Ease of Use: Features like tool-less nozzle replacement and simple three-point alignment make this automated assembly machinery easy to operate with minimal training.
Maximized Uptime & Reliability: A modular design and the use of fewer moving parts, including direct-drive motors, reduce maintenance needs and increase the long-term reliability of this chip bonding machinery.
XK-Marlin Die Bonder - Technical Specifications
This machine for die bonding applications is built to meet the rigorous demands of modern microelectronics bonding tools and substrate die placement systems.
| Category | Specification | Details |
| General Information | Item Number | XK-Marlin |
| Power Supply | 180-240 VAC, Single-phase, 50/60 Hz, 3.0 kVA | |
| Compressed Air | 85 liter/min @ 5.5 bar | |
| Floor Space (W x D x H) | 1,828 mm x 1,219 mm x 1,676 mm | |
| Weight | 800 kg | |
| Motion & Accuracy | X, Y, Z Axis | Linear Motor, 0.5 μm Resolution |
| Welding (Bonding) Area | 10 mm (X) x 100 mm (Y) | |
| Die Bonding Accuracy | XY ±38 μm @ 3 sigma | |
| Welding (Bonding) Pressure | 30 g ~ 300 g | |
| Vision & Handling | Vision System | XK |
| Image Recognition Mode | Feature Find, Single Point PR with Angle | |
| Die Bonding Size | 0.2 mm x 0.2 mm ~ 1 mm x 1 mm | |
| Lead Frame Size (Coil) | (L) x 20-100 mm (W) x 0.1 mm-0.2 mm max. (H) | |
| Process | Track Temperature Zone | 8 temperature zones |
| Protective Air | 0.1 MPa | |
| Optional Features | MAP Function | Workstation corresponding to each welding head |
| Welding Process Monitoring (BPM) | Requires corresponding dongle | |
| Pick Tool Wear Monitoring | Requires support data mode version | |
| Visual Dispensing Function | Requires corresponding hardware and software |
Advantages of XK-Marlin Die Bonding Machine
1. Enhanced Accuracy & Throughput
2. Superior Process Control
3. User-Friendly Operation
4. Maximized Uptime & Reliability
Why Choose Our Die Bonding Equipment?
We are a trusted provider of semiconductor assembly equipment, offering OEM/ODM and custom design services to ensure you get the perfect die attach bonding machinery for your needs.
Q: How do I choose a suitable machine?
A: Inform us of your workpiece material, size, and functional requirements. We will recommend the ideal die bonding equipment machine based on our extensive experience.
Q: What is the warranty period for the equipment?
A: We offer a one-year warranty on all our automatic die bonding equipment and provide 24/7 online technical support.
Q: Why choose us?
A: We specialize in creating tailored solutions. From wire bonding equipment to flip chip bonding machines and specialized wafer die attach systems, we have the expertise to deliver. Our commitment to innovation and reliability makes us the perfect partner for your electronic packaging equipment needs.