Adhesive Eutectic Flip-Chip Thermal Compression UV Curing
The HM-IMfully automatic die bonder delivers≤3 μm placement accuracy, programmable bonding force from 0.1–30 N, and thermal processing up to 450°C — all on a modular platform that supports adhesive, eutectic, flip-chip, and thermal compression bonding.
Designed for semiconductor R&D, pilot production, and small-batch manufacturing, the HM-IM enables engineers to evaluate multiple bonding technologies on a single system without the capital expense of dedicated production machines.
Supported Bonding Processes
One platform. Multiple processes.
- Adhesive Die Bonding — IC packaging, MEMS, LEDs, sensors
- Eutectic Bonding (Si-Au, AuSn) — Laser diodes, photonics, RF devices
- Flip-Chip Bonding — Advanced packaging, chiplets, SiP
- Thermal Compression Bonding — Fine-pitch assembly, die stacking
- UV Adhesive Curing — Optical modules, micro-components
Detailed process parameters available in the full datasheet.
Technical Specifications
| Placement Accuracy | ≤3 μm |
| Imaging Resolution | 0.5 μm |
| Wafer Sizes | 100 / 150 / 200 / 300 mm |
| Die Size Range | 0.4 × 0.4 mm – 30 × 30 mm |
| Die Thickness | 70 – 1100 μm |
| Bonding Force | 0.1 – 30 N (0.05 N resolution) |
| Max Temperature | 450°C (±1°C accuracy) |
| Heating Rate | Up to 10°C/s |
| Work Area | 100 × 200 mm |
| Package Types | TO-220, TO-247, TO-254, TO-258, TO-263, KT-series, custom |
Comparison: HM-IM vs. Conventional Production Die Bonders
| Aspect | Conventional Production Bonder | HM-IM |
|---|---|---|
| Primary Use | High-volume manufacturing | R&D, pilot, small-batch |
| Process Flexibility | Single process | Multiple processes |
| Changeover Time | Hours / days | Minutes (quick-change tooling) |
| Capital Investment | High (multiple machines) | One platform, multiple uses |
| Customization | Limited | High |
Applications by Industry
- Semiconductor — IC packaging, advanced packaging development, multi-chip modules
- Power Electronics — SiC, GaN, IGBT modules for EV, renewables, industrial
- Photonics — Laser diodes, photodiodes, optical communication modules
- Display — Mini LED, Micro LED development and repair
- Automotive — High-reliability power modules, sensors
- Research — Universities, R&D centers, pilot lines
Modular Configuration & Customization
The HM-IM is built on a modular architecture. Choose the modules that match your process requirements:
- Dispensing — Epoxy / silver paste application
- Eutectic Bonding — Si-Au, AuSn solder processes
- Thermal Compression — Heat + pressure bonding
- UV Curing — Rapid adhesive fixation
- Pulse Heating — Precision eutectic control
- Inert Gas Protection — Oxidation prevention
- Side-View Inspection — Process monitoring
Custom tooling available for: Die bonding nozzles, heated bonding heads, vacuum pallets (10×10 mm to 100×100 mm), package-specific fixtures.
Installation, Training & Support
- Installation — On-site guidance, mechanical setup, system initialization
- Process Acceptance — Accuracy testing, bonding validation, custom criteria
- Operator Training — Equipment operation, recipe creation, alignment setup, maintenance
- Documentation — Manuals, electrical specs, process guides
FAQ
- What is the placement accuracy? ≤3 μm with 0.5 μm CCD vision alignment.
- What bonding processes does it support? Adhesive, eutectic (Si-Au, AuSn), flip-chip, thermal compression, and UV curing.
- What wafer sizes are compatible? 100 mm, 150 mm, 200 mm, and 300 mm.
- What die sizes can it process? 0.4 × 0.4 mm to 30 × 30 mm, thickness 70–1100 μm.
- What is the maximum temperature? 450°C with ±1°C accuracy and 1°C setpoint resolution.
- Can it handle SiC and GaN devices? Yes, for eutectic and conductive adhesive bonding.
- Why choose HM-IM over a production die bonder? Flexibility. One platform for multiple processes, faster changeover, lower investment for R&D and pilot production.
Technical Review: Dr. Jian Li · Senior Process Engineer, Semiconductor Equipment Division · 15+ years in die bonding, micro-assembly, and advanced packaging.
Request Technical Information
Jiangsu Himalaya Semiconductor — Backend Manufacturing Equipment
Himalaya Semiconductor develops die bonders, wire bonders, wafer dicing systems, cleaning systems, and precision assembly tools. We serve the IC, power electronics, automotive, MEMS, LED, and photonics industries — from process development through production.
📥 The full datasheet includes:
- Complete technical specifications
- Detailed process parameters for each bonding method
- Full module list and configurations
- Dimensional drawings
- System requirements
- Ordering information
📧 Email: seaman@himalayasemi.com | 📞 Phone: +86-159-9582-2759