Himalaya HFT‑1000 Hybrid Film Thickness Measurement System
Key Features
| Feature | Benefit |
|---|---|
| Hybrid SR + SE in one head | Measure both thick (500 nm–500 µm) and thin (0.5 nm–50 µm) films without changing tools |
| Sub‑nanometer repeatability | ≤0.013 nm (static) on 202 nm SiO₂ – trust your process control limits |
| Built‑in wafer stress calculation | Uses Stoney formula with integrated laser bow measurement – no secondary tool |
| SECS/GEM (SEMI E30, E37) | Seamless integration with factory host, AMHS, and MES. Online/Offline modes |
| Broadband optics (250–1000 nm) | Standard; expandable to DUV (193 nm) or SWIR (2500 nm) for advanced materials |
| High‑precision motion stage | ±1 µm repeatability, 100 mm/s scan speed – full 12‑inch wafer mapping in <3 minutes |
Technical Specifications
| Parameter | Value |
|---|---|
| Thickness range (SR mode) | 500 nm – 500 µm |
| Thickness range (SE mode) | 0.5 nm – 50 µm |
| Wavelength range (standard) | 250 – 1000 nm |
| Expandable options | 193 nm (DUV) or 2500 nm (SWIR) |
| Repeatability (1018 nm SiO₂ on Si) | Static: ≤0.026 nm; Dynamic: ≤0.034 nm |
| Repeatability (202 nm SiO₂ on Si) | Static: ≤0.013 nm |
| Measurement spot size | 10 µm – 200 µm (user‑selectable) |
| Stage travel | 300 mm × 300 mm (12‑inch wafers, panels) |
| Stage repeatability | ±1 µm |
| SECS/GEM support | Yes (E30, E37, HSMS) |
| Stress measurement | Included (laser bow + Stoney formula) |
| Dimensions (system unit) | 800 mm (W) × 900 mm (D) × 1700 mm (H) |
| Power | 100–240 VAC, 50/60 Hz, 500 W |
Applications – Proven on Production Materials
| Material | Thickness Range | Mode | Typical Test Time |
|---|---|---|---|
| Die Attach Film (DAF) | 10–50 µm | SR | 0.5 sec/point |
| Mold compound (epoxy) | 100–500 µm | SR | 0.5 sec/point |
| Silicon nitride passivation | 100–500 nm | SE | 2 sec/point |
| Polyimide buffer layer | 5–15 µm | SR or SE | 2 sec/point |
| SiO₂ on Si (thin gate oxide) | 1–200 nm | SE | 2 sec/point |
| Bi‑layer (Polyimide + SiO₂) | 10 µm + 500 nm | SR+SE sequential | 4.5 sec/site |
✅ Validated on DAF lamination, compression molding, die bonding, and wafer-level passivation lines.
How It Works
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Load a wafer or substrate (manual or AMHS).
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Select recipe (material stack, measurement sites). System auto‑chooses SR or SE.
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Measure – broadband optics and precision stage collect spectral data.
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Output thickness map, refractive index (n,k), and wafer stress.
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Send data to factory host via SECS/GEM for closed‑loop process adjustment.
Why Choose the HFT‑1000 Over Alternatives?
| Competitor Approach | Limitation | HFT‑1000 Advantage |
|---|---|---|
| Single‑mode ellipsometer | Cannot measure thick films (>50 µm) | SR mode covers to 500 µm |
| Confocal / white light interferometer | Poor resolution on transparent thin films | SE mode resolves <1 nm |
| Contact stylus profiler | Slow, damages soft films (DAF) | Non‑contact, 0.5 sec/point |
| Separate stress measurement tool | Extra handling, alignment errors | Integrated bow + Stoney in one tool |
Factory Integration & Support
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SECS/GEM Standard – Plug‑and‑play with existing MES (factory acceptance tested).
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Offline mode – Standalone operation for engineering studies.
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Remote diagnostics – Secure VPN access for Himalaya support.
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Calibration kit – Includes NIST‑traceable SiO₂ on Si reference wafers.
Ordering Information
| Model | Description |
|---|---|
| HFT‑1000‑SRSE | Base system: 250–1000 nm, motion stage, SECS/GEM, stress module |
| ‑DUV | Optional DUV extension (193 nm for ultra‑thin high‑k films) |
| ‑SWIR | Optional SWIR extension (2500 nm for thick epoxy or silicon inspection) |
| ‑AMHS | Automated material handling interface (load port, mapping) |
Custom configurations available – contact sales.
Get a Quote or Demo
We offer on‑site demonstrations at Jiangsu Himalaya Semiconductor Co., Ltd. (Suzhou, China) or remote live testing with your sample wafers.
📧 Email: seaman@himalayasemi.com
📞 Phone: +86-15995822759
🌐 Web: www.himalayasemi.com
Company Address:
Room 4234, Building 11, No. 1258 Jinfeng South Road, Mudu Town, Wuzhong District, Suzhou City, China



