JCL-S500 | Precision Desktop Piezoelectric Dispensing System | 500Hz
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JCL-S500 Technical Deep Dive: Precision Desktop Piezoelectric Dispensing

The JCL-S500 is an industrial-grade, automatic dispensing platform engineered for high-accuracy semiconductor and electronics assembly. By integrating a Piezoelectric Ceramic Jetting Valve with a linear-motor-driven motion stage, the system achieves the sub-micron precision required for advanced packaging workflows.

    1. Motion Architecture & Structural Rigidity

    The system is built upon a welded, integrally formed machine frame to ensure maximum dampening and long-term mechanical stability.

    • Drive System: The XY-axis utilizes linear motors paired with linear encoders (grating scales) for closed-loop feedback, while the Z-axis is driven by a high-precision servo motor.

    • Kinematics: Features a maximum XY velocity of 1500 mm/s and acceleration of 1.5 G.

    • Precision: Delivers a repeat positioning accuracy of ±0.003 mm for XY and ±0.02 mm for Z.

    2. JPIU60222 Piezoelectric Jetting Performance

    The JCL-S500 is equipped with the JPIU60222 Piezoelectric Valve assembly, designed for non-contact dispensing of high-viscosity fluids.

    • Throughput: Supports a steady dispensing frequency of 500 Hz, with instantaneous bursts up to 1,200 dots/second.

    • Micro-Volume Control: Capable of a minimum dispensing volume of 0.01 μl.

    • Dispensing Consistency: Achieves a jetting dot consistency of 98% under stable pressure and temperature conditions.

    • Gap Capability: Engineered to jet into gaps as narrow as 0.3 mm with a minimum line width of 0.25 mm.

    3. Technical Specifications Matrix

    Specification Data Point
    Model JCL-S500
    Effective Work Area 350 × 350 mm
    Control Interface Industrial PC + Intelligent Dispensing Software (Windows)
    Vision System CCD Positioning (0.5M pixel, 27 × 27 mm FOV)
    Viscosity Compatibility 0 – 28,000 cps
    Heating Range Room Temp to +130°C (valve body and hose)

    4. Industrial Applications

    The JCL-S500 is optimized for high-density electronic components and semiconductor modules:

    • Semiconductor Packaging: Flip-chip underfill and chip bottom filling.

    • Mobile Electronics: Camera and fingerprint recognition module assembly, and phone frame bonding.

    • Component Reinforcement: FPC component reinforcement and LED packaging.

    • Advanced Processes: High-precision Dam & Fill applications.

    5. FAQ: Operational Integration

    What are the power and grid requirements for the JCL-S500?

    The system operates on Single-phase AC 220V (50/60 Hz) with a total power consumption of 1.5 kW. To ensure electronics longevity, the grid fluctuation must remain within < ±10%.

    What environmental controls are necessary for high-precision dispensing?

    Stability is critical. The operating environment must be maintained between 5°C and 30°C with temperature fluctuations limited to ±2°C. Humidity should be controlled within 45%–75%.

    How should the compressed air supply be configured?

    The equipment requires an input pressure of 0.5–1.2 MPa at a flow rate of ≥ 50 L/min. Crucially, compressed air must be dewatered and deoiled, then passed through an air dryer before entering the machine.

    Can the piezoelectric valve be easily maintained?

    Yes. The nozzle and needle assembly are designed to support quick disassembly and assembly, reducing downtime during fluid changeovers or cleaning.