Authored by Dr. Jian Li, Senior Process Engineer, Semiconductor Equipment Division

Experience: 15+ years in wire bonding, optical module packaging, COB assembly, and semiconductor automation equipment.

Technical Review: Dr. Chen Wei, CTO, Wafer Processing & Packaging Solutions Division

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Executive Summary

The K950 Automatic Optical Module Wire Bonderis a high-speed, high-precision semiconductor wire bonding machine designed specifically for COB (Chip-on-Board) optical module packaging. Engineered for 40G and 100G optical transceiver production, the K950 combines60 ms/wire bonding speed, ±2.5 μm positioning accuracy, advanced vision alignment technology, and fully automated material handling to deliver exceptional productivity and yield.

Built on the industry-proven K900 platform, the K950 supports TO38, TO39, TO46, and TO56 packages and enables manufacturers to rapidly deploy optical module production lines while minimizing training requirements and operational risks.

Key Benefits:

• High-speed bonding cycle of 60 ms per wire

• ±2.5 μm system positioning accuracy

• 0.5 μm vision alignment precision

• Compatible with mainstream TO package formats

• Proven K900 series platform reliability

• Fully automated loading and unloading system

• Optimized for 40G and 100G optical module manufacturing

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Why Choose the K950 Optical Module Wire Bonder?

Proven K900 Platform Technology

The K950 belongs to the highly successful K900 Series Wire Bonder family, which has become one of the most widely adopted TO-package wire bonding platforms in the industry.

Benefits of the Mature K900 Platform

• Proven performance in large-scale production environments

• Stable and reliable machine operation

• Extensive process know-how accumulated over years of field use

• Availability of experienced operators and engineers

• Established technical support ecosystem

• Reduced maintenance and operating costs

The mature platform significantly lowers production risks while improving overall equipment effectiveness (OEE).

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Applications

Optical Communication Module Packaging

The K950 is specifically designed for:

• 40G Optical Transceivers

• 100G Optical Transceivers

• High-Speed Optical Engines

• Fiber Optic Communication Devices

• Optical Network Components

• Data Center Optical Modules

Semiconductor and Photonics Packaging

Suitable for:

• Laser Diodes (LD)

• Photodiodes (PD)

• Optical Sensors

• Communication ICs

• Photonic Devices

• TO-CAN Packaging Applications

Supported Package Types

• TO38

• TO39

• TO46

• TO56

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Core Advantages

High-Speed Wire Bonding Performance

Production efficiency is critical for optical module manufacturers.

The K950 achieves:

Performance Parameter	Specification
Minimum Bonding Cycle	60 ms/wire
Typical Throughput	900 PCS/H
Package Example	TO56 / 4W / BSOB

The high-speed bonding capability supports volume production while maintaining stable bond quality.

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Exceptional Positioning Accuracy

Optical devices require precise wire placement to ensure electrical and optical performance.

Motion Control Performance

Parameter	Specification
System Positioning Accuracy	±2.5 μm
Vision Alignment Accuracy	0.5 μm
XY Resolution	0.1 μm
Z Resolution	0.2 μm

These specifications help maximize production yield and bonding consistency.

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Advanced Bond Head Technology

Bond Head System

Item	Specification
Z Resolution	0.2 μm
Travel Range	11 mm
Drive System	VCM Direct Drive Motor
Force Control	VCM Linear Motor

The VCM-driven bond head enables highly responsive motion control and precise force management.

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High-Precision XY Motion Platform

XY Worktable Specifications

Item	Specification
Resolution	0.1 μm
Travel Area	80 × 30 mm
Drive Method	AC Linear Motor

The direct-drive architecture reduces mechanical backlash and improves positioning repeatability.

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Intelligent Vision Alignment System

The K950 incorporates an advanced machine vision system optimized for optical device packaging.

Vision Features

• Sub-pixel positioning accuracy

• Grayscale pattern matching

• Shape recognition matching

• Automatic alignment correction

• High-speed image processing

Template Capacity

Type	Quantity
Main Templates	99
Auxiliary Templates	99

This enables reliable recognition of various device structures and bonding locations.

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Wire Bonding Process Capability

Ultrasonic Bonding System

Parameter	Specification
Ultrasonic Power	0 – 2.5 W
Ultrasonic Frequency	138 KHz
Bonding Force	3 gf – 250 gf
Temperature Range	Ambient – 250°C

Gold Wire Compatibility

Parameter	Specification
Standard Wire Diameter	15 – 38 μm
Maximum Wire Diameter	50 μm

The flexible process window supports a wide range of optical module assembly requirements.

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Automated Material Handling

Fixture System

The machine includes dual clamping fixtures compatible with:

• TO38

• TO39

• TO46

• TO56

This provides stable positioning throughout the bonding process.

Automatic Loading and Unloading

Features include:

• Independent loading station

• Independent unloading station

• Grating feedback positioning

• Continuous production support

The automation system helps reduce labor costs while improving production consistency.

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Fast Production Line Deployment

One of the key advantages of the K950 is its compatibility with the operational logic of K930 and K940 platforms.

Benefits

• Familiar user interface

• Reduced operator training requirements

• Existing process knowledge can be reused

• Faster production qualification

• Reduced startup costs

Manufacturers can quickly transition from TO packaging production to optical module assembly.

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K950 vs Conventional Optical Module Wire Bonders

Feature	K950	Conventional Equipment
Bonding Speed	60 ms/wire	80–120 ms/wire
Vision Accuracy	0.5 μm	1–2 μm
Position Accuracy	±2.5 μm	±5 μm
Optical Module Optimization	Yes	Limited
TO Package Compatibility	TO38/39/46/56	Varies
Automation Level	Fully Automatic	Semi-Automatic

The K950 delivers superior productivity, accuracy, and process stability for optical module manufacturers.

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Technical Specifications

Environmental Requirements

Item	Specification
Operating Temperature	15°C – 30°C
Operating Humidity	50% – 55% RH
Cleanroom Requirement	ISO 8 (FED Class 100,000) or Better

Utility Requirements

Item	Specification
Power Supply	AC220V ±5%, 50/60Hz
Vacuum Requirement	Below -53.32 KPa

Physical Specifications

Item	Specification
Dimensions	980 × 950 × 1770 mm
Weight	Approximately 550 kg

Magazine Dimensions

Item	Specification
Length	<250 mm
Width	<170 mm
Height	<50 mm

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Benefits for Optical Module Manufacturers

The K950 helps manufacturers achieve:

Improved Production Yield

High-precision alignment and bonding reduce process defects and improve first-pass yield.

Lower Operating Costs

The mature K900 platform minimizes downtime and maintenance expenses.

Faster Production Ramp-Up

Operators familiar with K930 and K940 systems can quickly transition to K950 production.

Enhanced Product Quality

Precise force control and positioning improve bond consistency and reliability.

Increased Throughput

The 60 ms/wire bonding speed supports high-volume manufacturing requirements.

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Industry Trends Driving Demand for Optical Module Packaging Equipment

The global expansion of AI infrastructure, hyperscale data centers, cloud computing platforms, and next-generation telecommunications networks continues to drive demand for advanced optical communication technologies.

As optical transceivers evolve from 40G and 100G toward 400G, 800G, and future high-bandwidth architectures, manufacturers require increasingly precise and efficient packaging solutions. Wire bonding remains a critical process in optical device assembly, making high-performance equipment essential for maintaining competitive manufacturing capabilities.

The K950 provides a proven solution for current production requirements while supporting future process development initiatives.

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Why Manufacturers Choose Himalaya Semiconductor

• Specialized in semiconductor packaging equipment

• ISO 9001 Quality Management System

• CE-Compliant Equipment Solutions

• Global customer support network

• Professional process development assistance

• Equipment installation and training services

• Export experience across international semiconductor markets

• Comprehensive after-sales technical support

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Frequently Asked Questions

What is the bonding speed of the K950?

The K950 achieves a minimum bonding cycle time of 60 milliseconds per wire, enabling high-volume optical module production.

Which package types are supported?

The system supports TO38, TO39, TO46, and TO56 package formats.

What wire sizes can be processed?

The machine supports gold wire diameters from 15 μm to 38 μm, with a maximum supported diameter of 50 μm.

Is the K950 suitable for 100G optical module production?

Yes. The K950 is specifically designed for 40G and 100G optical transceiver packaging and related optical communication applications.

What positioning accuracy does the system provide?

The K950 delivers ±2.5 μm positioning accuracy and 0.5 μm vision alignment accuracy.

Does the machine include automated loading and unloading?

Yes. The K950 features independent loading and unloading stations with grating feedback positioning for automated production.

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Request a Quote

Looking for a reliable wire bonding solution for optical communication packaging?

The K950 Automatic Optical Module Wire Bonder combines high-speed production, precision bonding, intelligent vision technology, and proven platform reliability to help manufacturers improve yield, reduce operating costs, and accelerate production deployment.

Contact Himalaya Semiconductor today to discuss:

• Production requirements

• Package compatibility

• Process evaluation

• Equipment configuration

• Automation integration

• Customized packaging solutions

Our engineering team can help you select the optimal wire bonding solution for your optical module manufacturing line.

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