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This high-performance, automatic laser lift-off machine is engineered for the precise separation of ultra-thin materials in semiconductor and microelectronics production. As a leader in laser processing technology, we provide advanced laser lift-off equipment solutions that deliver industry-leading accuracy, process stability, and reliability for your production line.

"Product Overview"

At a Glance: HM-01 Quick Specs

• Technology: High-precision UV Laser (355nm) "Cold Processing"

• Accuracy: 3μm repeatability for microscopic precision.

• Best For: High-density PCB assembly, Flexible circuits (Polyimide), and RF modules.

• Key Edge: Zero mechanical stress and no tool wear—ideal for sensitive components.

Modern PCB assembly demands flawless separation...

The IC/Wafer Laser Marking Machine is a fully automated, high-precision solution designed for marking and identifying 8-12 inch bare wafers. It features advanced wafer handling, high-resolution laser marking, OCR recognition, and clean-room compatibility. With SECS/GEM protocol support, it seamlessly integrates into semiconductor manufacturing processes, ensuring traceability and efficiency.