Full‑Automatic Laser Stealth Dicing Machine
What Is Laser stealth dicing?
Laser stealth dicing completely rethinks die separation. Instead of removing material, the laser beam passes through the silicon surface and focuses inside the wafer to create a modified SD (Stealth Dicing) layer – a narrow internal fracture plane.
The internal SD layer introduces deliberate, highly uniform structural weakness. Under gentle tensile stress or expansion force, wafers split cleanly into individual dies along the modified planes. Because no material is cut away from the top surface, the kerf width is zero – enabling the highest possible die count per wafer and eliminating surface damage entirely.
Core Advantages of Our Stealth Dicing Technology
1. Zero‑Kerf Dicing – Maximize Wafer Utilization
With no cutting street width consumed, die spacing shrinks to the design minimum. For high‑value, small‑die MEMS wafers, this directly translates to more chips per wafer and a significant reduction in raw silicon cost per die.
2. Unmatched Dicing Quality: Zero Chipping, No Cracks, No Unseparated Dies
Blade dicing often creates edge chipping, wavy lines and incomplete singulation – fatal for sensitive sensor chips. Our stealth dicing machine delivers verified, repeatable quality on 400 µm thick silicon substrates:
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No edge chipping on die walls
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Straight, meander‑free separation tracks
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100 % singulation – no residual unseparated dies
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Confined SD layer with zero surface damage
This performance meets the strictest requirements of medical MEMS, automotive inertial sensors and high‑reliability RFID devices.
Proven Dicing Quality: MEMS Microphone Wafer Test Data
In an internal dicing evaluation conducted under ISO/IEC 17025‑accredited lab procedures, our stealth dicing machine processed 200 µm‑thick MEMS microphone wafers. 100 % of the dies exhibited zero edge chipping, while a conventional blade saw produced a 4.7 % chipping rate under identical conditions. The full application note is available upon request.
Machine Overview & Full‑Automation Hardware
Built for high‑volume semiconductor manufacturing, the system integrates a complete unmanned workflow and is available for 6‑inch, 8‑inch and 12‑inch silicon wafers. Standard features include:
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Full‑automatic cassette‑to‑cassette wafer handling
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High‑precision optical recognition & positioning system
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Real‑time laser auto‑focus (AF) module
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Multi‑axis ultra‑precision motion platform on a marble base
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Full ESD anti‑static protection
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EMO emergency stop safety circuit
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SECS/GEM communication for smart factory MES integration
Ultra‑Precision Motion Platform & Vision System
Long‑term, micron‑level repeatability is guaranteed by a granite‑based, multi‑axis stage:
| Axis | Travel | Resolution | Repeatability |
|---|---|---|---|
| X | 380 mm | 0.5 µm | — |
| Y | 550 mm | 0.1 µm | ±1 µm |
| Z | 15 mm | 0.1 µm | — |
| θ (rotation) | 300° | 5,036,000 ppr encoder | — |
Four industrial CCD cameras handle every inspection task:
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1.25 MP low‑/high‑magnification detection cameras
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0.3 MP dedicated focus camera
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5 MP wide‑angle camera for full‑wafer contour and scribe lane mapping
Intelligent Features for Stable, Unmanned Mass Production
1. Real‑Time Laser Auto‑Focus (AF)
The non‑contact AF system continuously measures wafer surface height and dynamically adjusts the laser focal plane. This maintains a perfectly uniform SD layer depth across the entire wafer, compensating for substrate thickness variation. The system logs all focus data, triggers alarms and halts instantly if an abnormal deviation is detected – preventing defective batches.
2. Customizable Auto‑Calibration
Over long production runs, tiny positional drifts can shift laser tracks away from scribe lane centers. Our auto‑calibration module automatically pauses the sequence, verifies alignment and corrects the offset to within ±1 µm of the lane center.
Users can set the calibration interval (number of lanes processed) and a Δy deviation threshold. If the offset exceeds the limit, the machine locks operation and requests operator inspection – eliminating the risk of large‑area flawed dies.
3. Comprehensive Industrial Automation Controls
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Dual operating modes: Fully automatic and manual debug
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Three‑tier user authorization: Admin, Engineer, Operator – securing recipes and data
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Editable process recipes supporting multi‑pitch, mixed‑die production
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Complete logging: alarm records + operation history for full traceability
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Built‑in barcode scanning, real‑time kerf image preview and laser power self‑check
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One‑click integration of auto alignment, auto‑focus and auto‑calibration
Standard Technical Specifications & Installation Requirements
Machine Dimensions (with stack light): 2070 mm × 1420 mm × 2238 mm
Net Weight: 2.7 tons
Power Supply: 220 VAC ±10 %, 50/60 Hz, 10 A, voltage fluctuation < 5 % (complies with SEMI S2 / GB 4793.1 safety standards)
Operating Environment: 20 °C–25 °C, 40–60 % relative humidity, Class 1000 cleanroom (ISO 14644-1 Class 5) or better
Compressed Air: 0.5–0.8 MPa CDA (clean dry air), Φ12 mm interface
Site Restrictions: To ensure long‑term stability, do not install the machine in areas with:
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Dust, waste, oil mist or chemical pollution
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Vibration, mechanical impact or frequent shock
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High‑frequency electromagnetic interference
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Rapid temperature fluctuations
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Elevated concentrations of CO₂, NOₓ or SO₂ gases
Fully Automatic Wafer Processing Workflow
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The clamp transfers a wafer ring from the cassette to the midpoint station for contour alignment and recognition.
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The upper suction arm moves the ring to the loading station.
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The precision chuck table shifts the wafer to the laser processing area for stealth dicing.
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After laser modification, the wafer moves to the unloading station.
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The lower arm returns the finished wafer to the midpoint for secondary alignment verification.
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The clamp places the singulated wafer ring back into the original cassette.
This touch‑free cycle eliminates manual handling and minimizes particle contamination.
Applications
The system is designed for silicon wafer lines manufacturing:
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MEMS microphones for smartphones, hearables and smart assistants
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Accelerometers & gyroscopes for wearables, automotive stability and inertial navigation
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Pressure, thermal & gas sensors for industrial IoT and environmental monitoring
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RFID sensor wafers for logistics, retail and asset tracking
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Thin silicon substrates (standard 400 µm thickness) and other small‑die applications
Laser Stealth Dicing vs. Traditional Blade Dicing
| Factor | Laser Stealth Dicing | Blade Dicing |
|---|---|---|
| Kerf loss | Zero | 60–100 µm, depending on blade |
| Edge chipping | None | Common, especially small dies |
| Particle generation | Minimal | High (debris, silicon dust) |
| Die cracking risk | Eliminated (internal fracture) | Real, from mechanical stress |
| Tool wear | No consumables (laser) | Blade wear, frequent replacement |
| Automation integration | Native SECS/GEM, auto‑focus & calibration | Limited auto‑correction |
| Wafer size flexibility | 6/8/12‑inch, single platform | Often dedicated per size |
Why Choose Jiangsu Himalaya Semiconductor?
Proven Expertise – Jiangsu Himalaya Semiconductor Co., Ltd. specializes in advanced laser processing equipment for the semiconductor and MEMS industries. Our proprietary laser engine and motion control algorithms are developed in‑house, supported by our R&D center in Xi’an High‑tech Zone.
Authoritative Integration – Machines are compliant with international cleanroom and safety standards (SEMI S2, ISO 14644-1). The SECS/GEM interface enables seamless integration into smart factories. Three‑tier user management and comprehensive logging support quality audits and traceability.
Trusted Local Support – With dual locations in Suzhou and Xi’an, we provide rapid on‑site service, application support and spare parts supply. Both facilities are backed by experienced process engineers and field service teams.
Commitment to Uptime – The auto‑focus, auto‑calibration and self‑diagnostic functions dramatically reduce operator intervention and human error, leading to higher machine availability and consistent die quality.
Contact & Facilities
Jiangsu Himalaya Semiconductor Co., Ltd.
Head Office (Suzhou)
Room 4234, Building 11, No. 1258 Jinfeng South Road
Mudu Town, Wuzhong District, Suzhou City, 215101, China
Xi’an Branch
No. 58, Keji 3rd Road, High‑tech Zone
Yanta District, Xi’an City, Shaanxi Province, 710075, China
For wafer dicing demonstrations, technical specifications, or a customized production proposal, contact our sales team through our official website or visit one of our technology centers.
Download the full technical datasheet and MEMS microphone dicing application note:
Please contact our team to request the complete documentation.
Frequently Asked Questions (FAQ)
Q: What wafer materials can the machine process?
A: It is optimized for silicon wafers. For other materials (e.g., SiC, glass), please consult our application team.
Q: How is die singulation carried out after laser modification?
A: The internally modified wafer is expanded using a standard tape expander or similar gentle mechanical separator, causing the dies to separate cleanly along the SD planes.
Q: Can the machine handle wafers on film frames?
A: Yes, the standard configuration supports wafer rings/film frames used in dicing‑before‑grinding (DBG) and standard processes.
Q: What is the typical maintenance interval?
A: The laser source has a long service life with minimal consumables. Routine maintenance focuses on optics cleaning and motion system checks; intervals depend on production volume, and our field service team provides recommended schedules.
Upgrade your MEMS dicing line with the zero‑kerf, fully automatic stealth dicing solution from Jiangsu Himalaya Semiconductor – precision engineered for the next generation of sensor chips.