Precision Laser Lift-Off Machine for Advanced Semiconductor Manufacturing
This advanced laser processing system features high-precision linear drive systems for the laser head, wafer platform, and alignment camera. Its core components, backed by robust software and process controls, make it a top-tier solution for demanding applications like GaN LED manufacturing, micro-LED display production, and advanced packaging.
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Product Advantages: Unmatched Precision and Control
Our precision laser lift-off systems are designed to excel in critical semiconductor manufacturing processes, offering significant advantages for your production operations.
Pinpoint Accuracy & High Throughput
Optimized motion control, high-resolution vision systems, and advanced laser beam delivery ensure consistent processing quality and perfect alignment, even at high speeds. This maximizes yield and efficiency in your laser lift-off applications.
Superior Process Control & Consistency
With integrated laser energy monitoring, temperature management, and real-time process validation, this system provides unparalleled control over the lift-off process. This eliminates substrate damage, ensures complete separation, and guarantees consistent quality batch after batch.
Unmatched Versatility & Ease of Use
A user-friendly software interface allows for easy programming of complex processing patterns. Features like quick-change optics and simple calibration make it easy to switch between different material systems and process requirements with minimal downtime.
Maximized Uptime & Robust Design
A rigid, thermally stable frame and the use of high-quality, industrial-grade laser components reduce maintenance needs and increase the long-term reliability of this advanced semiconductor processing equipment.
Technical Specifications Table
This machine is built to meet the rigorous demands of modern semiconductor manufacturing, from R&D to high-volume production.
| Category | Specification | Details |
|---|---|---|
| General Information | Model Number | LLO-3000 Pro |
| Power Supply | 380 VAC ±10%, Three-phase, 50/60 Hz, 6.0 kVA | |
| Cooling System | Closed-loop Chiller Required | |
| Floor Space (W×D×H) | 2000 mm × 1500 mm × 2200 mm | |
| Machine Weight | 1200 kg | |
| Operating Environment | Class 1000 Cleanroom, Temperature: 20±1°C, Humidity: 45±5% RH | |
| Laser System | Laser Type | UV DPSS Laser |
| Wavelength | 266 nm / 355 nm (Optional) | |
| Maximum Pulse Energy | 2.0 mJ @ 266 nm | |
| Repetition Rate | 10-100 kHz | |
| Pulse Width | < 20 ns | |
| Beam Quality | M² < 1.3 | |
| Motion & Positioning | Drive System | Linear Motor Direct Drive |
| Positioning Accuracy | ±1.0 μm | |
| Repeatability | ±0.5 μm | |
| Maximum Speed | X/Y: 800 mm/s | |
| Minimum Step | 0.1 μm | |
| Vision & Alignment | Camera System | High-Resolution 8MP CCD Camera |
| Alignment Accuracy | ±2.0 μm | |
| Pattern Recognition | Automatic Fiducial Recognition | |
| Magnification | 5X-20X (Optional) | |
| Process Capability | Substrate Size | 2-inch to 8-inch wafers |
| Process Area | 300 mm × 300 mm | |
| Throughput | Up to 60 wafers/hour (2-inch) | |
| Laser Spot Size | 10 μm - 100 μm (Adjustable) | |
| Software & Control | Control System | Industrial PC with 21" Touch Screen |
| Programming Method | Graphical User Interface | |
| Recipe Management | 500+ process recipes | |
| Data Logging | Full process parameter recording | |
| Interface | SECS/GEM, Ethernet, USB |
Optional Features & Accessories
| Option Type | Available Features |
|---|---|
| Laser Options | Higher Power Laser Head |
| Multiple Wavelength Configuration | |
| Beam Shaping Optics | |
| Automated Attenuator | |
| Automation Options | FOUP/LPU Load Port |
| Robot Wafer Handling | |
| Integrated Metrology | |
| In-line Thickness Measurement | |
| Process Monitoring | Real-time Energy Monitoring |
| Plasma Detection System | |
| Automatic Focus Monitoring | |
| Thermal Mapping System | |
| Software Upgrades | Advanced Process Control |
| Predictive Maintenance | |
| Remote Diagnostics | |
| Yield Management System |
Key Application Solutions
Micro LED (μ-LED) Display Manufacturing
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Sapphire Substrate Detaching: Precision separation of GaN epitaxial layers from sapphire substrates
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Mass Transfer Enablement: Clean, damage-free lift-off process for micro LED mass transfer
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High-Yield Production: Optimized for high-density micro LED arrays and display applications
Power Device Fabrication
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Ultra-thin Wafer Processing: Detaching process for wafers as thin as 20μm
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Backside Metal Compatibility: Safe processing of wafers with metallized backside
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Wide Bandgap Materials: Support for Si, SiC, and GaN power devices
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Thermal Management: Advanced thermal control for sensitive power device structures
Our Client
We are honored to work closely with a wide range of renowned partners across the semiconductor equipment ecosystem. Globally, we collaborate with industry leaders such as Honeywell, Foxconn, and HP. In China, we partner with top enterprises including Sunny Optical Technology, Sanan Optoelectronics, HT-Tech, Tsinghua Tongfang, TUS Holdings, and TCL. We also join forces with leading academic institutions such as Xi'an Jiaotong University and Northwestern Polytechnical University, leveraging their research capabilities to drive technological innovation and promote the implementation of cutting-edge solutions in the semiconductor equipment sector.
Why Choose Our Laser Lift-Off Equipment?
We are a trusted provider of semiconductor manufacturing equipment, offering OEM/ODM and custom design services to ensure you get the perfect laser lift-off solution for your specific material systems, throughput requirements, and process integration needs.
Frequently Asked Questions (FAQ)
Q: What materials and applications is this machine suitable for?
A: This machine is specifically designed for laser lift-off processes in GaN/sapphire separation, micro-LED mass transfer, thin film debonding, and advanced packaging applications. We can customize the system for your specific material system and process requirements.
Q: How do I choose the right laser lift-off machine for my application?
A: Contact us with your substrate details (material, size, thickness), target throughput, and specific process requirements. Our applications engineers will recommend the optimal laser configuration and system specification.
Q: What is the warranty and technical support?
A: We offer a comprehensive 18-month warranty on all our laser lift-off systems, backed by 24/7 technical support, regular maintenance services, and readily available spare parts.
Q: Do you provide process development support?
A: Yes, we have a fully equipped application lab where we can help develop and optimize your laser lift-off process. We provide complete process transfer and operator training services.
Q: Why should I choose your company?
A: We specialize in creating tailored laser processing solutions for the semiconductor industry. From R&D systems to high-volume production tools, we have the expertise to enhance your manufacturing process. Our commitment to innovation, quality, and your success makes us the ideal partner.
Ready to advance your semiconductor manufacturing capabilities? Contact our laser processing experts today for a consultation and application evaluation.