Jiangsu Himalaya Semiconductor Launches 12‑Inch Fully Automatic Soft Solder Die Bonder for High‑Volume Power Device Assembly

2026-09-04

SUZHOU, China – September 4, 2026 – Jiangsu Himalaya Semiconductor Co., Ltd. , a fast‑growing Chinese supplier of advanced semiconductor back‑end equipment, today announced the global release of its new 12‑inch fully automatic soft solder die bonding system. Designed from the ground up for 300 mm wafer structures, the machine also maintains seamless backward compatibility with 8‑inch and 6‑inch products, offering a versatile solution for power device packaging in electric vehicles (EVs), renewable energy inverters, and industrial motor drives.

As the power semiconductor market races toward a projected US$50 billion by 2028, the demand for high‑reliability, high‑throughput assembly equipment has never been more urgent. Himalaya's new bonder directly answers this call, delivering class‑leading 6,000–9,000 units per hour (UPH) while achieving ±1.5 mil (38 μm) placement accuracy and ±2° angular deflection—metrics that place it on par with established international brands.

Breakthrough Solder Void Control and Thermal Performance

For power devices, solder voiding is a critical failure mechanism. The new system excels in this area:

Single‑void ratio ≤ 2%
Total void area ≤ 5% of the die surface
Solder coverage guaranteed at 100% for pads with edges extending beyond 10 mil

These results are achieved through an advanced 8‑zone heating + 3‑zone cooling thermal system, capable of reaching 450°C with an accuracy of ±3°C. The bonder supports solder wire diameters from 0.25 mm to 1.0 mm and offers flexible delivery modes (Sn, Write, Press) to accommodate diverse process recipes.

Broad Material Compatibility for High‑Mix Production

The equipment handles a wide variety of substrates and components, making it ideal for both high‑volume and mixed‑line manufacturing:

Parameter	Range
Wafer (die) size	0.5 × 0.5 mm up to 14 × 14 mm
Substrate length	110 – 300 mm
Substrate width	12 – 102 mm
Substrate thickness	0.1 – 1.0 mm

Supported package types include PDFN, TO252‑8R, TO220/247/3P, SOP, DPAK matrix, and photovoltaic device substrates, ensuring broad applicability across automotive, industrial, and consumer electronics segments.

Designed for Efficiency and Ease of Integration

Plant engineers will appreciate the machine's compact footprint and low utility demands:

Specification	Value
Dimensions (W×D×H)	1,900 × 1,400 × 1,700 mm
Weight	~1,600 kg
Bonding pressure	30 – 300 g (programmable)
Power supply	220/240 VAC, 50/60 Hz
Power consumption	~1,100 W / ~2,200 W
Compressed air	250 LPM @ 3 bar (15% H₂ + 85% N₂ required)

The servo‑controlled hydraulic system, combined with a dual‑pump oil circuit, ensures stable operation with minimal energy consumption—just 0.6 kW/h during normal running (excluding heating).

Global Market Focus and Strategic Advantage

Manufactured at Himalaya's headquarters in Suzhou, the new bonder leverages China's robust semiconductor equipment supply chain to offer a cost‑performance ratio that is 30–60% lower than comparable imported systems, without compromising quality. The company holds ISO 9001 and CE certifications, and has passed a third‑party audit by Bureau Veritas.

With over 200 global customers across 30+ countries, Himalaya is positioning this machine for:

EV power module suppliers (SiC/IGBT inverters, OBC) in North America and Europe,
Industrial drive and renewable energy manufacturers requiring TO‑247 and DPAK packaging,
OSAT facilities in Southeast Asia scaling up 12‑inch wafer processing capabilities.

About Jiangsu Himalaya Semiconductor Co., Ltd.

Founded in 2019 and headquartered in Suzhou, Jiangsu Province, Jiangsu Himalaya Semiconductor Co., Ltd. is a high‑tech enterprise dedicated to the R&D, manufacturing, and sales of semiconductor back‑end assembly and test equipment. Its core product portfolio includes fully automatic die bonders, wire bonders, wafer dicing systems, laser processing tools, and automated dispensing machines. The company holds over 10 patents and is committed to providing high‑precision, high‑stability, and cost‑effective equipment solutions for power devices, 5G communications, MEMS, and automotive electronics.

Availability and Support

The new 12‑inch soft solder die bonder is available for immediate order. Himalaya offers a standard one‑year warranty on the main body, servo motors, touchscreen HMI, PLC, and hydraulic valves. On‑site installation, commissioning, and training services are provided, with a service response commitment of 24–48 hours for international clients.

For technical data sheets, sample processing, or a factory demonstration, please contact the Himalaya sales team.

Media Contact:
Jiangsu Himalaya Semiconductor Co., Ltd.
Sales Department
Email: seaman@himalaya-semi.com
Phone: +86 15995822759
Address: Wuzhong District, Suzhou, Jiangsu, China