High-Precision Laser Decapsulation Machine CL300-IC Launches: A New Enabler for Semiconductor Failure Analysis
Xi'an, China – September 1, 2026 – The "CL300-IC Laser Decapsulation Machine," a high-end equipment tailored for semiconductor failure analysis, has officially captured industry attention. Featuring exceptional processing accuracy, intelligent control systems, and military-grade protective design, the device offers a brand-new technical solution for precision applications such as IC chip decapsulation and component thinning.
Core Technology Breakthrough: Dual-CCD Vision System & Intelligent Control
The standout feature of the CL300-IC is its dual-CCD high-definition vision system. This system enables real-time monitoring, full-process recording, and image analysis during processing, ensuring that engineers have complete visibility over every detail. Its software supports zone-differentiated parameter settings, allowing users to independently configure laser power and scanning paths based on the specific characteristics of different areas (e.g., molding compound edges, internal metal layers) and materials—truly achieving "processing on demand."
Highly Reliable Process: Non-Destructive Substrate & Automatic Stop
In semiconductor failure analysis, the key metric for equipment performance is the ability to remove packaging materials without causing any damage to internal bonding wires, pads, or the chip substrate itself. The CL300-IC employs a high-quality professional laser source with exceptionally stable power output (available in 5W/20W options), effectively preventing substrate damage caused by energy fluctuations.
Furthermore, the built-in automatic stop control technology can automatically halt processing when a preset depth is reached or when the metal layer is exposed. This feature seamlessly handles chip decapsulation across varying thicknesses and depths, significantly improving operational success rates and repeatability.
Industrial-Grade Protection & Compact Design
To accommodate the complexities of both laboratory and production environments, the CL300-IC features a fully enclosed protective structure with an IP54 ingress protection rating. This design provides robust resistance against dust, dirt, and moisture, making it reliable even in harsh conditions. Additionally, the machine adopts an integrated compact design with overall dimensions of just 900x600x820mm, minimizing its footprint and maximizing space utilization—making it ideal for research institutions, university labs, and testing centers.
High-Precision Platform & User-Friendly Operation
The system is equipped with an automatic lift-and-focus mechanism and a precision fine-tuning loading stage (with positioning accuracy of ±0.05mm), greatly facilitating precise workpiece positioning before processing and ensuring accurate scanning paths. Its working area covers 50x50mm, complemented by a visual monitoring system of the same range, fully meeting the decapsulation requirements of standard IC devices.
About the Equipment
The CL300-IC Laser Decapsulation Machine operates in clean environments with temperatures ranging from 10–30°C and humidity levels between 40%–75%. Combining high precision, robust protection, and intelligent operation, the device is now open for sample testing and inquiries across the global semiconductor failure analysis market.