Comprehensive Back - end Semiconductor Equipment for a Competitive Edge

An extensive line of back-end semiconductor equipment from our company provides manufacturers with a competitive advantage. The Die Bonding and wire bonding machines have a solid track record as they are known for their fast and precise works. Not only can they bond semiconductor dies to substrates and connect them with fine wires, they also do so in a way that ensures the electrical connections are reliable.

The SMT Pick-and-place machine/SMD Assembly Machine is a flexible solution for the assembly of surface mount technology. It can work with many different types of components, thus increasing the effectiveness of the assembly process. As for the Silicone Dispensing Equipment, it offers the capability of dispensing silicone materials with pinpoint accuracy. These materials are introduced to encapsulate and protect semiconductor devices. It can be seen that with these back-end equipment, our company is in a good position to fulfill the semiconductor industry's back-end manufacturing requirements.