High-Speed Clip Bonding System
2026-01-04
Core System Capabilities
| Capability | Description |
|---|---|
| Throughput | High-speed processing of up to 20 clips/cycle |
| Motion Control | High-precision linear drive die bond head for superior repeatability |
| Integrated Punching | High-precision clip punching system for on-the-fly customization |
| Smart Dispensing | Multi-dispensing independent control with automatic glue filling and detection |
Technical Specifications
1. Die Attach (DA801 / DA1201)
| Parameter | Specification |
|---|---|
| Placement Accuracy | ±10–25 μm @ 3σ |
| Theta Accuracy | ±1° @ 3σ |
| Force Control | Ultra-stable dynamic force system |
| Processes Supported | Dipping, Jetting, Writing Epoxy |
2. Clip Bonding
| Parameter | Specification |
|---|---|
| Placement Accuracy | ±50 μm @ 3σ |
| Theta Accuracy | ±3° @ 3σ |
| Inspection | Pre-bond, Post-bond, Solder Patch & Paste |
| Drive System | High-precision Linear Drive |
3. Vacuum Reflow Module
| Parameter | Specification |
|---|---|
| Vacuum Design | Stepwise 5-stage design |
| Atmosphere | Intelligent N₂ monitoring & control |
| Maintenance | Replaceable heating modules; Auto-flux recovery |
Key Advantages
- Superior Thermal Path – Direct copper clip interconnects significantly improve thermal conductivity compared to wire bonding.
- Enhanced Electrical Performance – Reduces parasitic resistance and inductance for high-efficiency switching.
- Zero-Void Reliability – 5-step vacuum process ensures high-reliability solder joints in power modules.
- Market Versatility – Flexible configurations to meet specific market demands and customization needs.
Applications
| Sector | Typical Uses |
|---|---|
| Automotive | EV inverters, On-board chargers (OBC), DC/DC converters |
| Industrial | High-power motor drives, Renewable-energy inverters |
| Consumer | Fast-charging adapters, High-density power supplies |
Notation
- All accuracies are stated at 3σ.
- N₂ denotes nitrogen atmosphere control.
- Clip count per cycle refers to maximum theoretical throughput under optimal conditions.