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Himalaya Semi Secures New Patent for Automated GPP Chip Coating Technology

2025-12-24

Solving Industry Challenges: Beyond Manual Operation

In traditional GPP chip coating processes, operators often face safety risks and contamination issues when manually positioning chips inside the equipment. Furthermore, manual feeding often leads to inconsistencies in coating thickness, which can affect the final yield of semiconductor components.

Himalaya Semi GPP Chip Coating Machine Patent CN221602422U

Core Technical Innovation: Precision & Safety

This patented technology introduces a sophisticated mechanical coordination system designed to eliminate human error:

  • Automated Threaded Rod Driving System: Powered by a high-precision motor, the system allows the placing plate to move automatically into the coating chamber. This eliminates the need for operators to reach inside the machine, ensuring both safety and a cleanroom-compliant environment.

  • Pneumatic Coating Mechanism: Utilizing advanced cylinders to drive the coating nozzles, the system ensures a perfectly uniform distribution of adhesive across the chip surface.

  • Integrated Material Delivery: The direct connection between the feeding pump and the glue tank minimizes material exposure, preventing adhesive curing and reducing waste.

A Commitment to EEAT: Innovation and Verified Reliability

As a leader in semiconductor equipment, including laser annealing and laser cutting solutions, Himalaya Semi views R&D as the bedrock of our authority. With over 10 core patents now in our portfolio, we continue to set new standards in the industry.

Beyond our technical breakthroughs, our reliability is further backed by our BV-Verified Online Store. The combination of National Patent Certification and International Third-Party Verification (BV) provides our global clients with the ultimate assurance of quality and professional integrity.

About Himalaya Semi

Jiangsu Himalaya Semiconductor Co., Ltd. is a high-tech enterprise specializing in the R&D and manufacturing of critical semiconductor equipment. By integrating cutting-edge laser technologies with automated mechanical solutions, we help our partners optimize production efficiency and achieve superior product reliability.