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This high-speed, precision die bonding machine is engineered for the thermal bond encapsulation of low-power devices and microelectronics. As a leader in die bonding machine technology, we provide advanced die bonding equipment solutions that deliver industry-leading productivity and reliability for your semiconductor assembly line.

This automatic die bonding equipment features linear drive systems for the welding head, wafer platform, and positioning camera. Its core components, including an enhanced pattern recognition function, are backed by extensive reliability data, making it a robust and high-performance industrial die bonding equipment solution.

"TL;DR"

The Himalaya 002 is a fully automatic, Omron PLC-controlled semiconductor injection molding machine. It supports clamping pressures up to 1764 kN and is optimized for high-volume encapsulation of QFN, BGA, and TO packages.

The HMLY-5881X Wire Bonder delivers ±3µm precision for advanced microelectronics. Engineered for complex 3D assembly, it excels in deep-cavity (up to 9mm) packaging of MEMS devices, laser modules, and sensitive sensors, ensuring high reliability in demanding manufacturing environments.

"Product Overview"

At a Glance: HM-01 Quick Specs

• Technology: High-precision UV Laser (355nm) "Cold Processing"

• Accuracy: 3μm repeatability for microscopic precision.

• Best For: High-density PCB assembly, Flexible circuits (Polyimide), and RF modules.

• Key Edge: Zero mechanical stress and no tool wear—ideal for sensitive components.

Modern PCB assembly demands flawless separation...

The DA801 is a fully automatic wafer die bonder / die attach machine engineered for high-speed, high-accuracy die placement in semiconductor packaging lines. It combines a dual dispensing system, a high‑precision linear-driven bond head, and a highly accurate die rotation system to support stable throughput and consistent placement quality.

Designed for 6"–8" wafers (150–200 mm) and a wide range of substrates/lead frames, DA801 supports EPOXY process control, DAF (Die Attach Film) workflows, and automation-ready communication for production integration.

The Automatic Silicone Glue Dispensing Equipment is a high-performance industrial robot designed to replace manual dispensing operations. It offers precise control over dispensing velocity, time, angles, and volume, ensuring consistent and efficient production. Suitable for various industries, this robot improves production efficiency and quality while reducing labor costs.

The H580PLUS High-Speed Fully Automatic Wire Bonder is an advanced solution for semiconductor packaging, offering ultra-high precision and speed with ±3μm repeatability and a bonding cycle of just 1.45ms per line. It features a linear motor-driven XY table, advanced vision system, and multi-material compatibility, ensuring high reliability and consistent quality. Certified with CE, ISO, RoHS, and FDA, this wire bonder is designed for efficiency and innovation.

The IC/Wafer Laser Marking Machine is a fully automated, high-precision solution designed for marking and identifying 8-12 inch bare wafers. It features advanced wafer handling, high-resolution laser marking, OCR recognition, and clean-room compatibility. With SECS/GEM protocol support, it seamlessly integrates into semiconductor manufacturing processes, ensuring traceability and efficiency.

The Vacuum Ion Implantation System is a high-precision accelerator designed for semiconductor doping, surface modification, and thin-film fabrication. It supports 2"–8" wafers and offers a wide range of implantable ions (B, P, As, Al, S, H, Mg, Si) with acceleration energies from 5keV to 200keV. Key features include low-energy implantation for shallow junctions, high-temperature processing, and advanced vacuum engineering.

In advanced semiconductor manufacturing, the final step of wafer singulation (die separation) has a direct impact on yield, reliability, and overall cost. Based in Suzhou, Jiangsu, China, Jiangsu Himalaya Semiconductor supplies a fully automatic, high‑precision wafer dicing machine designed for demanding silicon and compound semiconductor applications.

This system combines ultra‑fine linear motion, CCD/laser vision alignment, automatic blade wear compensation, and SECS/GEM connectivity to deliver stable, repeatable wafer dicing for ICs, power devices, MEMS, sensors, and photonics.

Discover the high-precision Wafer Dicing Saw for semiconductor manufacturing. With linear motor drive, ±0.5μm repeatability, and laser alignment, this fully automatic machine ensures precise dicing for Si, GaAs, GaN, and other materials. SECS/GEM integration enables real-time monitoring and data management, while advanced features like automatic blade wear compensation extend tool life. Ideal for high-volume production.