Products Categories

The IC/Wafer Laser Marking Machine is a fully automated, high-precision solution designed for marking and identifying 8-12 inch bare wafers. It features advanced wafer handling, high-resolution laser marking, OCR recognition, and clean-room compatibility. With SECS/GEM protocol support, it seamlessly integrates into semiconductor manufacturing processes, ensuring traceability and efficiency.

The Vacuum Ion Implantation System is a high-precision accelerator designed for semiconductor doping, surface modification, and thin-film fabrication. It supports 2"–8" wafers and offers a wide range of implantable ions (B, P, As, Al, S, H, Mg, Si) with acceleration energies from 5keV to 200keV. Key features include low-energy implantation for shallow junctions, high-temperature processing, and advanced vacuum engineering.

In advanced semiconductor manufacturing, the final step of wafer singulation (die separation) has a direct impact on yield, reliability, and overall cost. Based in Suzhou, Jiangsu, China, Jiangsu Himalaya Semiconductor supplies a fully automatic, high‑precision wafer dicing machine designed for demanding silicon and compound semiconductor applications.

This system combines ultra‑fine linear motion, CCD/laser vision alignment, automatic blade wear compensation, and SECS/GEM connectivity to deliver stable, repeatable wafer dicing for ICs, power devices, MEMS, sensors, and photonics.

Discover the high-precision Wafer Dicing Saw for semiconductor manufacturing. With linear motor drive, ±0.5μm repeatability, and laser alignment, this fully automatic machine ensures precise dicing for Si, GaAs, GaN, and other materials. SECS/GEM integration enables real-time monitoring and data management, while advanced features like automatic blade wear compensation extend tool life. Ideal for high-volume production.