Semiconductor Descum System for Wafer Surface Cleaning – Complete OEM Guide (2026)

By Dr. Jian Li
Senior Process Engineer, Semiconductor Packaging & Assembly
*15+ Years in Die Sorting, Pick‑and‑Place Kinematics, and IC Packaging Automation*

Jiangsu Himalaya Semiconductor Co., Ltd.
Himalaya Semi focuses on advanced back‑end semiconductor processes, including high‑precision wafer descum systems tailored to modern IC manufacturing.

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1. Introduction

In semiconductor manufacturing, even a monolayer of organic residue can cause device failure. Descum (or descumming) – the removal of photoresist scum and organic contaminants after lithography – has become a yield‑critical step.

This article provides a technical overview of a professional semiconductor descum system, using real, field‑proven specifications. You will learn:

• How plasma descum works

• Key technical parameters (RF source, MFC, vacuum system)

• Applications in wafer surface cleaning

• Pricing, lead time, and after‑sales support

Whether you are a fab engineer, procurement manager, or R&D buyer, this guide helps you evaluate descum equipment for 4″ to 12″ wafers.

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2. What Is a Semiconductor Descum System?

A semiconductor descum system uses oxygen‑based plasma to remove:

• Photoresist residues after development

• Organic polymers from etch/deposition processes

• Contaminants before wafer bonding or packaging

Unlike wet cleaning, plasma descum is dry, non‑destructive, and compatible with advanced nodes (≤ 28nm). The system described here is a high‑power (5 kW) RF inductively coupled plasma (ICP) machine designed for both silicon and compound semiconductors (GaAs, SiC, GaN, InP).

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3. Key Technical Specifications

These specifications are based on actual production units from Jiangsu Himalaya Semiconductor.

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4. How the Descum System Works (Plasma Cleaning Process)

4.1 RF ICP Plasma Generation

The system uses a 13.56 MHz RF inductively coupled plasma source (or optional dual‑frequency). High‑density plasma is generated remotely or directly, depending on the process.

4.2 Chemical Reaction

O₂ gas is introduced via MFC. Oxygen radicals (O*) react with organic residues:
CₓHᵧO₂ + O* → CO₂↑ + H₂O↑

4.3 Byproduct Removal

A dry vacuum pump continuously evacuates volatile products, leaving a clean, activated wafer surface.

4.4 Key Advantages over Wet Cleaning

• No chemical waste

• No surface tension damage (ideal for high aspect ratio features)

• Uniform cleaning across 200 mm / 300 mm wafers

• Low cost of ownership

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5. Applications in Wafer Surface Cleaning

This descum system is used for:

Typical applications: Photoresist ashing of silicon‑based and compound semiconductors, resist removal after high‑dose ion implantation, cleaning of metal surfaces, residual resist removal, contaminant removal, and pre‑treatment for wafer‑level packaging.

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6. Why Choose This Descum System?

6.1 High Uniformity & Repeatability

The combination of MFC, automatic pressure control, and RF ICP ensures within‑wafer non‑uniformity < 5% (typical).

6.2 Damage‑Free Processing

Remote plasma option prevents ion bombardment damage – critical for GaAs and other sensitive substrates.

6.3 Fully Automated Operation

Robotic wafer handling (single or dual arm) enables cassette‑to‑cassette processing, ready for fab integration.

6.4 Low Contamination Design

Dry vacuum pump and stainless steel chamber minimize particle generation.

6.5 OEM Customization

Jiangsu Himalaya Semiconductor offers:

• Custom chamber sizes

• Multi‑gas capability (O₂, CF₄, Ar, N₂)

• Extra load ports

• Software customization for specific recipes

6.6 After‑Sales Support Included

• 1‑year warranty (free parts replacement)

• Online technical support

• Video outgoing inspection (provided)

• Machinery test report (provided)

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7. Market Context: Why Descum Demand Is Growing

The global semiconductor market is expected to approach US$1 trillion by 2030 (SEMI forecast). As chip geometries shrink to 3nm and below, resist residue removal becomes more challenging:

• EUV lithography requires ultra‑clean surfaces to avoid defectivity.

• 3D NAND and DRAM use high aspect ratio etching – any remaining scum blocks the etch front.

• Advanced packaging (chiplet, hybrid bonding) demands pristine bonding interfaces.

Therefore, investing in a dedicated descum system is not an option but a necessity for high‑yield production.

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8. Pricing, Lead Time & Logistics

Typical OEM pricing (FOB Shanghai, China):

• Shipping: FOB Shanghai China. Negotiable shipping methods (sea, air, express).

• Payment terms: To be discussed directly with supplier (wire transfer, letter of credit, etc.).

For buyers requiring installation or training, the supplier offers online technical support and video guidance.

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9. Frequently Asked Questions (FAQ)

Q1: What wafer sizes are supported?
A: The system can handle 4″, 6″, 8″ and 12″ wafers. Custom cassettes available.

Q2: Can it be used for GaN / SiC?
A: Yes. The remote plasma configuration prevents ion damage, making it suitable for wide‑bandgap materials.

Q3: What is the maintenance interval?
A: With a dry pump and automatic pressure control, typical maintenance is every 6‑12 months under normal use.

Q4: Is a cleanroom required?
A: The system is designed for Class 1000/ISO 6 cleanrooms or better.

Q5: Do you provide a test report?
A: Yes. A machinery test report is included with each system.

Q6: Can the plasma source be upgraded?
A: Yes, dual‑frequency plasma source is available as an option.

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10. Conclusion

The Semiconductor Descum System for Wafer Surface Cleaning (HSD‑BW series) from Jiangsu Himalaya Semiconductor offers a cost‑effective, high‑performance solution for removing organic residues from wafers. With 5 kW RF ICP plasma, MFC gas control, automatic pressure regulation, and robotic wafer handling, it meets the needs of R&D labs, pilot lines, and volume fabs.

Key takeaways for procurement:

• Typical price: US$28,000–30,000 (FOB)

• 1‑year warranty + free spare parts

• Customizable for compound semiconductors

• Manufactured by an experienced semiconductor equipment supplier

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11. Contact the Author & Company

Dr. Jian Li – Senior Process Engineer, Semiconductor Packaging & Assembly

Jiangsu Himalaya Semiconductor Co., Ltd.

Headquarters & R&D Center
Room 4234, Building 11, No. 1258 Jinfeng South Road,
Mudu Town, Wuzhong District, Suzhou City, Jiangsu Province, China

Sales Office
No. 58, Keji 3rd Road,
High‑Tech Zone, Yanta District, Xi’an, China

For technical discussions and quotation requests:
Please contact our sales team directly via the company’s official channels.