High-Precision UV Laser Depaneling & FPC Cutting Systems
Himalaya Semiconductor offers state-of-the-art UV Laser Depaneling Machines designed for the stress-free separation of rigid and flexible printed circuit boards. Our HM-01 Advanced Laser Depaneling System provides micron-level accuracy, eliminating the mechanical stress and burrs associated with traditional routing or sawing methods.
Specially engineered for the electronics industry, our FPC Laser Cutters are ideal for complex geometries in high-density interconnects (HDI). By utilizing cold-cutting UV technology, we ensure minimal Heat Affected Zones (HAZ), preserving the integrity of sensitive components. Our lineup further supports advanced manufacturing with Automatic Wafer Laser Marking and Stealth Dicing solutions for silicon and SiC substrates.
