DS9260: High-Precision Automatic Dicing Saw for Semiconductor Wafer Processing

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Key Parameter	Specification
Wafer Size	12 inches (300mm)
Groove Depth	0–5 mm
Kerf Width	0.015–0.5 mm
Worktable Flatness	±1 μm

Dual-Spindle High-Speed Architecture for Maximum Productivity

The DS9260's opposing high-power dual spindle configuration (2.2 kW × 2) enables simultaneous processing, dramatically increasing throughput for semiconductor packaging applications. Coupled with the integrated Non-Contact Measurement System (NCS), this system ensures precise blade positioning and depth verification throughout the die singulation process.

Key Productivity Features:

• Simultaneous or sequential automatic wafer dicing

• 1,000–60,000 RPM spindle speed range

• Integrated vision alignment system

• Real-time process monitoring

Complete Automation: From Loading to Unloading

Experience truly fully automated dicing with the DS9260's integrated workflow. The system handles:

1. Automated wafer loading and pre-alignment

2. Precision wafer processing with real-time adjustments

3. Integrated two-fluid cleaning station

4. Automated unloading and sorting

This complete automation minimizes manual intervention, reduces contamination risk, and ensures consistent yield improvement across production batches.

Intelligent Quality Control Systems

The DS9260 incorporates multiple detection systems to maintain exceptional high precision dicing quality:

Non-Contact Measurement System (NCS)

Ensures accurate blade-to-wafer positioning and groove depth verification without surface contact.

Blade Health Monitoring

• Blade Detection Function: Monitors wear and status

• Blade Damage Detection (BBD): Automatically identifies integrity issues

• What is Blade Damage Detection (BBD)? A proprietary system that prevents costly wafer damage by detecting blade abnormalities in real-time.

Automated Process Control

• Workpiece shape recognition for varying geometries

• Optional data scanning for full traceability

• Real-time parameter adjustment

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Technical Specifications: Precision Engineering

Motion System Performance

Category	Parameter	Specification
Basic Parameters	Processing Size	12 inches
	Groove Depth	0–5 mm
	Groove Width	0.015–0.5 mm
	Worktable Flatness	±1 μm
X/Y-Axis	Drive Method	Linear Motor
	Effective Stroke	310 mm
	Motion Resolution	0.1 μm
	Speed Range	1–800 mm/s
Z-Axis	Drive Method	Servo Motor + Ball Screw
	Effective Stroke	40 mm
	Motion Resolution	0.1 μm
	Single-Step Positioning Accuracy	1 μm
	Full-Stroke Positioning Accuracy	3 μm
θ-Axis	Drive Method	Servo Motor + Harmonic Drive
	Rotation Range	0–360°
	Motion Resolution	0.001°
	Repeat Positioning Accuracy	±2 arcsec
Spindle System	Rotation Speed	1,000–60,000 rpm
	Output Power	2.2 kW × 2
	Alignment System	Dual FOV CCD + Laser Positioning
Utility Requirements	Power Supply	AC 380V, 50/60 Hz, 8 kVA
	Compressed Air	0.6–0.8 MPa, 500 L/min
	Dicing Water	0.2–0.4 MPa, 200 L/min
	Cooling Water	0.2–0.4 MPa, 300 L/min
	Exhaust Airflow	8.0 m³/min (ANR)
Physical Specifications	Dimensions	1200 × 1600 × 1800 mm (W×D×H)
	Weight	2200 kg
Environmental Requirements	Temperature	20–25°C (±1°C)
	Humidity	40–60% RH
	Compressed Air Quality	Dew point ≤ -15°C, Oil ≤ 0.1 ppm

Environmental & Utility Requirements

• Operating Environment: 20–25°C (±1°C), 40–60% RH

• Cleanroom Equipment compatible design

• Power: AC 380V, 8 kVA

• Compressed Air: 0.6–0.8 MPa, dew point ≤ -15°C

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Applications: Versatile Dicing Solutions

Semiconductor Packaging

• QFN dicing and BGA singulation with high accuracy

• Fan-Out WLP (Wafer-Level Packaging)

• Advanced IC packaging applications

LED & Optoelectronics

• LED wafer dicing of sapphire and GaN substrates

• Dicing saw for optoelectronics manufacturing

• Photonic components and optical devices

Advanced Materials Processing

• Dicing saw for silicon and ceramic materials

• MEMS and sensor singulation

• RF components and communication chips

Material Compatibility & Dicing Blade Selection

The DS9260 supports a comprehensive range of materials essential for modern electronics manufacturing:

Primary Material Groups

• Semiconductors: Silicon, SiC, GaN

• Ceramics: Alumina, Aluminum Nitride

• Glass & Optics: Quartz, Fused Silica

• Composites: PCB, specialty laminates

Dicing Blade Compatibility Guide

Our dicing saw blade compatibility expertise ensures optimal performance for your specific application:

• Diamond blades (resin, metal, ceramic bond)

• SDC (Solid Diamond Core) technology

• Custom configurations for specific kerf width requirements

• Material-specific blade recommendations

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Compatible Materials

Silicon Wafers, PCB, Ceramics, Glass, Hard-Coated Lithium, Aluminum Oxide, Quartz, Lithium with Coating

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Automated Workflow for Peak Efficiency

Phase 1: Intelligent Loading

The lower pick-and-place arm retrieves wafers from cassettes, with automatic pre-alignment ensuring perfect orientation before vacuum mounting on the worktable.

Phase 2: Precision Dicing Operations

High-speed spindles execute programmed dicing patterns while the NCS system continuously monitors and adjusts cut parameters in real-time for consistent die singulation quality.

Phase 3: Integrated Cleaning

The upper transport arm moves processed wafers to the two-fluid cleaning station, removing all particulates and residues before hot-air drying.

Phase 4: Automated Unloading

Finished wafers return via the alignment verification station to output cassettes, completing the closed-loop automated cycle.

Maintenance & Service: Maximizing Your Investment

Our comprehensive dicing saw maintenance service programs ensure optimal performance and longevity:

Support Ecosystem

• Preventive Maintenance: Scheduled inspections and calibrations

• Remote Diagnostics: Secure connection for rapid troubleshooting

• On-Demand Service: Expert field engineering support

• Training Programs: Operator and maintenance certification

• Spare Parts: Guaranteed availability of critical components

Competitive Analysis: DS9260 vs. Market Alternatives

Case Study: Transforming QFN Packaging Production

A leading precision dicing saw supplier implemented the DS9260 for a major semiconductor manufacturer's QFN dicing line, achieving remarkable results:

Performance Improvements

• 45% Throughput Increase: Dual-spindle processing reduced cycle times

• 99.2% Yield Rate: NCS and BBD systems minimized die fracture

• 60% Labor Reduction: Full automation eliminated manual handling

• 25% Blade Life Extension: Intelligent monitoring optimized blade usage

Why Partner with Us for Your Dicing Needs?

When you compare automatic dicing saw models, the DS9260 stands apart through:

Technical Superiority

• Industry-leading precision with ±1 μm worktable flatness

• Advanced Non-Contact Measurement System (NCS)

• Robust dual spindle architecture for maximum productivity

Operational Excellence

• Complete automation reduces operational costs

• Intelligent systems prevent costly errors

• Wide material compatibility for production flexibility

Comprehensive Support

• Expert guidance on how to improve wafer dicing yield

• Full dicing saw maintenance service programs

• Application-specific engineering support

Total Cost of Ownership Advantages

• Higher throughput reduces per-unit costs

• Enhanced yield minimizes material waste

• Reduced downtime through proactive maintenance

• Lower labor requirements through full automation

Next Steps: Transform Your Dicing Operations

The DS9260 automated 12-inch wafer dicing system represents the future of precision semiconductor manufacturing. Whether you're processing advanced semiconductor packaging, performing LED wafer dicing, or working with challenging materials like ceramics and composites, this system delivers the accuracy, speed, and reliability demanded by modern production environments.

Ready to evaluate the DS9260 for your application?
[Contact our engineering team] for:

• Detailed DS9260 dicing saw specifications

• Application-specific performance data

• Dual spindle dicing machine price quotations

• Live demonstration scheduling

• Custom workflow analysis