Wafer Dicing Saw for Semiconductor Industry
Key Features & Industry-Leading Advantages
Wafer Dicing Saw for Semiconductor Manufacturing
High-Precision Dicing System with Ultra-Fine Motion Accuracy
Key Features
✔ Precision Motion System
Linear motor drive with ±0.5μm repeatability
Adaptive speed control (1-300mm/s) for brittle/hard materials
✔ Multi-Material Compatibility
Semiconductor Wafers: Si, GaAs, GaN, SiC
Packaging Substrates: PCB, QFN/DFN leadless packages
Specialty Materials: Glass, ceramics, piezoelectric materials
✔ Intelligent Process Control
Laser alignment + machine vision (CCD positioning accuracy ±3μm)
Automatic blade wear compensation (extends tool life by 30%)
Wafer Dicing Saw Machine Configuration
| X axis | maximum effective | 310mm | 310mm | 210mm |
| 0.1-1000mm/s | 0.1-600mm/s | |||
| Y axis | max effective | 310mm | 310mm | 170mm |
| single step increment | 0.0001mm | 0.0001mm | 0.0001mm | |
| reach accuracy | 0.003mm/310mm | 0.003mm/310mm | 0.003mm/170mm | |
| Z axis | maximum effective | 40mm | 40mm | 40mm |
| repetition accuracy | 0.001mm | 0.001mm | 0.001mm | |
| maximum cutter diameter | 58 | 58 | 58 | |
| T axis | maximum rotation angle | 380° | 380° | 380° |
| spindle | speed range | 6000-60000rpm | 6000-60000rpm | 6000-60000rpm |
| output power | 1.8KW(2.4KW) | 1.8KW(2.4KW) | 1.5KW (2.4KW) | |
| power | AC380V±10% | AC380V±10% | AC380V±10% | |
| Size W×D×H | 1200mm×1629mm×1849mm | 1080mm×1160mm×1800mm | 630mmx900mmx1600mm | |
Technical specifications
- DC air bearing spindle
- spindle power 1.8-2.4KWoptional
- 36000-60000 RPM/min
- 2-inch knife/3-inch knife
- double spindle spacingminimum 24mm
- Flatness of cutter face:≤002mm
- Reach accuracy:+0.003mm
- Easy maintenance, mechanicalpositioning
- Safety cover to extend theservice life of NCS
- Automatic measurement inprocessing according to the number of cutting tools or meters
- Strong anti-interference, underthe interference of water vapor,the blade is still stably detected
- High sensitivity, signal feedbacktime is short
- Minimum measurement5*0.5mm
Central system function
- Remove machine alarm processing
- The alarm processing time is high, the production lien personnel walk less, saving manpower
The machine is full automatic, auto loading, alignment, cutting, cleaning and drying
SECS GEM function:
- Can monitor the status of the device in real time; For example, ldle, Run, Down;
- Download/Upload Device Data for unified parameter management.
- Can collect and statistics all the Event information of the equipment, including material information, operationinformation, alarm information, etc.
- You can set the alarm level, when the problem occurs, you can lock the device and ask for specific permissions toremove the alarm and deal with the problem