High-Precision Non-Contact Glass Processing System (700 × 650 mm)

Product Overview

The Ultrafast Laser Glass Cutting and Cleaving Machine (Dual-Station) is a high-end industrial precision system developed for non-contact, ultra-clean glass micromachining applications.

Built by Himalaya Semiconductor, the system integrates ultrafast femtosecond/picosecond laser technology, precision motion control, and dual-station automation architecture.

It is designed for high-throughput manufacturing environments in display, semiconductor, and advanced optical industries.

Executive Summary

Modern semiconductor devices demand smaller, thinner, and more reliable dies. Traditional blade dicing struggles with chipping, cracking, and kerf loss—especially for brittle or wide-bandgap materials.

Laser Stealth Dicing (LSD) addresses these challenges by performing non-contact wafer singulation. Jiangsu Himalaya Semiconductor Co., Ltd.’s DR-S-WLNC100 and DR-S-WLNC300 systems use advanced internal laser modification technology to create controlled fracture planes inside wafers. When the wafer is expanded, it separates cleanly into individual dies without surface damage.

By: Dr. Jian Li, Senior Process Engineer, Semiconductor Equipment Division
Dr. Li has 15 years of experience in micro-machining.

Silicon Carbide (SiC) wafers are characterized by high hardness and significant brittleness. During the dicing process, they are prone to issues such as chipping and irregular crack propagation, which directly impact the yield of subsequent chips. Traditional blade dicing creates a large heat-affected zone (HAZ), requires extensive post-processing, and struggles with backside metallization.

To address these challenges, Jiangsu Himalaya Semiconductor Co., Ltd. (“Himalaya Semi”) offers a dedicated SiC wafer dicing solution. This article presents our complete process workflow, from wafer mounting to die ejection, with detailed technical specifications for our Fabsil-LD series (laser cutting) and Fabsil-WB series (wafer cleaving) systems.

Introduction

In the fast-evolving semiconductor and electronics manufacturing industry, precision and efficiency are paramount. Wafer dicing machines play a critical role in the production line, enabling the precise cutting and singulation of silicon wafers and other substrate materials. For manufacturers and researchers in Malaysia—especially within the high-tech hubs of Penang and Kulim—sourcing high-quality wafer singulation equipment is essential for maintaining competitive production standards.

China has become a global leader in semiconductor equipment, offering a blend of advanced technology and competitive pricing. This article explores the benefits of sourcing from a wafer dicing machine supplier in China and provides practical guidance for those looking to buy wafer singulation equipment in Malaysia.

Wafer dicing is a critical backend step that often limits yield due to edge chipping, debris contamination, extra cleaning, and wasted wafer area from wide cutting streets. This laser stealth dicing machine (also used as a silicon dicing machine) solves these issues by creating an internal modification layer inside the wafer using a focused infrared (IR) laser, then separating the dies by controlled external force.

Designed for production environments, the system supports Silicon (Si), Silicon Carbide (SiC), LED sapphire, and solar-related substrates, with stable processing enabled by dedicated IR optics, a high-precision motion platform, and autofocus + dynamic autofocus.

Written by: Dr. Jian Li, Senior Process Engineer, Semiconductor Equipment Division.

Author Credentials: Dr. Li has 15 years of experience in micro-machining and is the lead patent holder for our DS9260 dicing saw's control system.

Wafer dicing machines are critical tools in semiconductor manufacturing, used to separate individual semiconductor chips from a processed wafer. As a key step in fabricating electronic devices and integrated circuits (ICs), these machines enable the mass production of components found in everything from smartphones to automotive systems. The process handles various semiconductor materials, with silicon-based wafers being the most common, though materials like gallium arsenide are also essential for high-frequency and optoelectronic applications.

Himalaya Semiconductor's Commitment: This analysis leverages proprietary data collected over 10,000 hours of continuous operation in our state-of-the-art ISO 9001-certified manufacturing facility, ensuring the technical accuracy of our specifications.

Wafer dicing is the final, decisive operation that turns a processed silicon wafer containing hundreds or thousands of integrated circuits (ICs) into individual, functional semiconductor chips. The wafer dicing solution you choose has a direct impact on yield, reliability, cost, and time‑to‑market.

This article explains the role of wafer dicing in IC production and provides a clear, practical comparison of the three main dicing technologies:

• Blade Dicing
• Laser Dicing
• Stealth Dicing

The DS9260 represents the pinnacle of automatic dicing saw technology, engineered specifically for high precision dicing of 12-inch wafers and substrates. This fully automated wafer dicing machine integrates advanced dual spindle dicing saw configuration with intelligent metrology systems to deliver unparalleled accuracy and throughput in semiconductor dicing and packaging applications.

In advanced semiconductor manufacturing, the final step of wafer singulation (die separation) has a direct impact on yield, reliability, and overall cost. Based in Suzhou, Jiangsu, China, Jiangsu Himalaya Semiconductor supplies a fully automatic, high‑precision wafer dicing machine designed for demanding silicon and compound semiconductor applications.

This system combines ultra‑fine linear motion, CCD/laser vision alignment, automatic blade wear compensation, and SECS/GEM connectivity to deliver stable, repeatable wafer dicing for ICs, power devices, MEMS, sensors, and photonics.

Discover the high-precision Wafer Dicing Saw for semiconductor manufacturing. With linear motor drive, ±0.5μm repeatability, and laser alignment, this fully automatic machine ensures precise dicing for Si, GaAs, GaN, and other materials. SECS/GEM integration enables real-time monitoring and data management, while advanced features like automatic blade wear compensation extend tool life. Ideal for high-volume production.