Automatic IC/Wafer Laser Marking Machine

✅ Wafer Handling:  
- Supports FOUP loading via an advanced Loadport system  
- Robot arm film transmission for smooth and precise wafer transfer  
- Automatic calibrator for accurate wafer center & angle correction  

✅ Marking & Identification:  
- High-resolution laser marking for wafer edge ID (permanent & non-damaging)  
- OCR recognition detection (optional) for automated verification  

✅ Smart Automation & Connectivity:  
- Automatic scanning for process efficiency  
- SECS/GEM protocol support for seamless integration with customer’s factory system (Industry 4.0 ready)  

✅ Clean-room Compatibility (Optional):  
- FFU (Fan Filter Unit) air purification system for contamination control  
- Smoke & dust collection & filtration system for a cleaner working environment 

This fully automated, high-precision laser marking system ensures traceability, efficiency, and reliability in semiconductor production, meeting the stringent requirements of modern IC and wafer manufacturing.  

Applications: Semiconductor wafer marking, IC packaging, MEMS, LED, and advanced electronics manufacturing.  

For more details, customization, or a demo, feel free to contact us! 

1. Replace the human labor and save labor cost.
2. Simple and convenient operation, high speed and precise control.
3. Realize the precise dispensing by the high-precision motor.
4. High performance Linear structure platform with nice appearance.
5. High-rigidity aluminum alloy multi-axis design ensures reliability and accuracy.

Font Support:
SEMI-compliant fonts:
5×9 (single-line density)
10×18 (double-line density)
Arabic font support for specialized marking requirements
Custom font integration (upon request)

Barcode & 2D Code Support:
BC-412 SEMI T1 barcode (industry-standard for wafer ID)
QR Code / Data Matrix (optional) for enhanced traceability
Custom marking layouts & symbol formats

Category	Specification
Control System	Galvo scanning head + control card, Windows 7/10 OS
Laser Wavelength	532nm (green laser for high-precision marking)
Cooling Method	Water-cooled / air-cooled (flexible configurations)
File Formats	DXF, PLT (compatible with CAD/design software)
Power Supply	Single-phase 220V, 4KW (excludes smoke/dust filter)

✔ Wafer ID marking (SEMI-compliant alphanumeric/barcodes)
✔ IC traceability & packaging (QR/Data Matrix for logistics)
✔ MEMS, LED, power devices (precision marking for small components)

Supported Sizes:
Option 1: 2-4-6 inches
Option 2: 4-6-8 inches
Option 3: 8-12 inches
Special Wafer Handling: Customizable for non-SEMI shapes/materials.

Parameter	Specification
Centering Time	≤3 seconds
Position Accuracy	±0.1mm (wafer center), ±0.1° (edge/gap)
Detection Method	LED lighting + image recognition sensors
Size Switching	Command control or communication protocol (SECS/GEM)

Cleanliness: ISO Class 2 (independent exhaust inside drive structure).
Power Supply:
Arm/Drive: DC24V ±10%, 16A
Stepper Motors: 2-phase, DC24V ±10%, 3A (controller embedded in body).
Vacuum: >-53kPa (Bernoulli suction cup: 0.5MPa compressed air).

✅ High-Speed Precision: Sub-micron accuracy for critical wafer handling.
✅ Flexible Integration: Supports SEMI standards and factory automation (SECS/GEM).
✅ Cleanroom Ready: ISO Class 2 compliance with minimal particulate contamination.
✅ Scalable Solutions: Customizable for odd-shaped wafers and multi-size production lines.