High-Speed Automatic Wire Bonder for Semiconductor Packaging
Introduction to Advanced Wire Bonding Technology
The AWB-01-A High-Speed Fully Automatic Gold/Copper Wire Bonder by Jiangsu Himalaya Semiconductor Co., Ltd. embodies the forefront of innovation in semiconductor packaging. This machine is engineered for precision ball bonding and wedge bonding processes, utilizing gold, copper, and aluminum wires to create reliable electrical interconnections in the most demanding applications.
Designed specifically for IC, LED, optoelectronic, and advanced microelectronic semiconductor packaging applications, this equipment delivers unmatched speed, precision, and reliability. Integrating linear motor drive systems, intelligent force calibration, and next-generation optics, it sets new benchmarks in ultra-fine wire bonding technology.
Detailed Wire Bonder Specifications & Tolerances
| Feature | Specification & Tolerance |
|---|---|
| Model No. | AWB-01-A |
| Condition | New |
| Certifications | CE, ISO, RoHS, CCC, PSE, FDA |
| Warranty | 12 Months |
| Automatic Grade | Fully Automatic |
| Max Bonding Area | X: 56mm, Y: 80mm |
| Positioning Accuracy | ±3μm (@3σ) |
| Bonding Cycle Time | 45ms/wire |
| Wire Diameter Range | Φ15–50μm (Au/Cu/Al compatible) |
| Drive System | Linear Motor (Direct Drive) |
| Repeatability | ±3μm (@3σ) |
| Magazine Compatibility | L: 100–275mm, W: 30–90mm, H: 65–180mm |
| Dimensions (W×D×H) | 985mm × 960mm × 1770mm |
| Weight | ≈660kg |
| Production Capacity | 100 units |
Key Features of Our High-Speed Wire Bonder
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Enhanced Motion & Precision
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Servo system with faster response and higher accuracy.
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Linear motor-driven XY table with ±3μm repeatability.
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Ultra-fast bonding cycle: 45ms/wire.
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Advanced Optical & Imaging System
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High-performance zoom lens with distortion-free imaging.
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High-precision Post-Bond Inspection (PBI) for defect-free interconnections.
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Intelligent Bonding Force Control
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Adaptive force feedback prevents wire breakage and pad damage.
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Smart calibration system for real-time adjustments.
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Superior Arc Control
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Optimized wire arc algorithm for Au, Cu, and Al wires.
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Consistent loop shapes in high-density ICs (BGA, QFP, COB).
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Proprietary Core Technologies
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Independent IP in drive systems, optics, and control algorithms.
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Ensures industry-leading reliability and performance.
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Material Handling & Workflow Efficiency
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Automated Loading/Unloading with vertical stacked magazines (2–3).
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Broad Magazine Compatibility: Length 100–275mm, Width 30–90mm, Height 65–180mm.
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Adjustable Pitch: 1.5–10mm for diverse product layouts.
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Fast Production Rhythm: 45ms soldering cycle per line drives high throughput.
Benefits of Owning the AWB-01-A Wire Bonder
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Maximized Uptime & Yield: Exceptional reliability and precision minimize rework and scrap, boosting overall production output.
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Unmatched Return on Investment (ROI): High speed (45ms/wire) and reduced maintenance lower cost per device, accelerating payback.
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Future-Proof Flexibility: Compatibility with gold, copper, and aluminum wires across a wide diameter range allows adaptation to evolving packaging trends.
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Simplified Integration & Operation: Automated handling and intuitive controls reduce operator training time and streamline workflow.
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Global Support & Assurance: Backed by a full-year warranty, ISO certification, and Himalaya's global technical support network.
Explore Our Full Range of Wire Bonder Models
| Parameter | Specification |
|---|---|
| Working Area | X: 300mm/0.05μm; Y: 300mm/0.05μm; Z: 50mm/0.05μm; T: ±220°/0.01° |
| Wire Bonding Range | 4mil–20mil (100μm–500μm) |
| Ribbon Wire Range | 20×4mil–80×10mil (500×100μm–2000×250μm) |
| Bonding Force | Al wire: 50g–1500g; Cu wire: 100g–8000g |
| Ultrasonic System | 60KHz or 80KHz Transducer; 30W–100W Generator |
| Production Cycle | ≤1 second |
| Power Supply | 200–240VAC, 50–60Hz, 1500W |
| Dimensions | 960mm × 1400mm × 1700mm |
Packaging & Shipping
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Secure Packaging: Shock-absorbing bubble foam + wooden crate.
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Global Logistics: Road, sea, and air freight options.
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Guaranteed Safety: Equipment delivered in perfect condition worldwide.
Certifications & Patents
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ISO 9001 certified manufacturer.
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6 registered utility model patents in China.
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Patented technologies include semiconductor annealing systems, UV debonding machines, and cleaning equipment for etching.
Semiconductor Packaging Applications for Wire Bonding
Our high-speed wire bonder is precisely engineered for a broad spectrum of critical applications:
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IC Packages: TO, SOT, SOP, SSOP, TSSOP, QFP, DIP, BGA, COB.
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Optoelectronics: LEDs, Optocouplers, laser diodes.
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Advanced Devices: Fine-pitch and high-power modules, MEMS sensors, advanced wafer-level processing.
About Himalaya Semiconductor
Founded in 2019, Jiangsu Himalaya Semiconductor Co., Ltd. has rapidly become a trusted partner in the global semiconductor industry. With exports to 30+ countries and a growing client base of 200+ customers, we deliver cost-effective, high-precision equipment solutions.
Our Core Product Portfolio:
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Laser Marking & Cutting Systems
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Automatic Dicing Saws
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Silicone Dispensing Equipment
Watch Our Die Bonder in Action!
Curious to see the AWB-01-A in action? Check out our demonstration video on YouTube to witness its capabilities firsthand!
Frequently Asked Questions (FAQ)
Q1: How do I choose the right wire bonding machine for my production?
A: Provide us with your specific material (Au, Cu, Al), device dimensions, and output requirements. Our technical experts will recommend the optimal model for your semiconductor packaging needs.
Q2: What does the warranty and support cover?
A: The AWB-01-A comes with a comprehensive one-year warranty. We provide 24/7 online technical support to ensure your operations run smoothly.
Q3: How can I ensure the machine is compatible with my existing line?
A: Share your detailed bonding process parameters and production floor layout. Our team will verify compatibility and provide integration guidance for a seamless setup.